Fabrication Facilities
Class 1K clean room
Class 10K clean room
Metal sputtering system
Four 4" DC sputtering guns
Base pressure < 1x10-8 torr
Nb, NbTiN, NbN, Al, ultra-thin AlN barrier
Reactive ion etching system, SF6, CHF3, O2, Ar
Chip dicing machine
Quartz substrate lapping machine
2" wafer
Minimum thickness ~30um
Surface profile
Optical microscope and PR spin coater
x2000 magnification, Dimension measurement software
2000-8000rpm programable PR coating system