Run #340 NbN deposition
a. Wafer :SiO2/ testchip/ HRSi/Testchip
b. Wafer clean : no
c. Mounting : with diffusion pump oil
d. RF-clean : No
e. Working gas: Ar : 12 / N2 : 3.3 (SCCM), 7.4 mtorr
f. Thickness:162 A, rate: 13.56 A/s
g. Current: 1.7A
h. Tc=10.5 K for NbN/HRSi
Tc=10.6 K for NbN/MgO