Al deposition
a. Wafer : HEB (NbN)/ testchip
b. Wafer clean : no
c. Mounting : with diffusion pump oil
d. RF-clean : No
e. Working gas: Ar : 12 (SCCM), 5.2 mtorr
f. Thickness: 57sec, 107 A ( rate: 1.83 A/s)
g. Current: 0.15A