Nb deposition (#M2-278)
a. Wafer : test chip, Fused Quartz, Fused Quartz wafer
b. Wafer clean : no
c. Mounting : with diffusion pump oil
d. RF-clean : No
e. Working gas: Ar : 12 (SCCM), 10 mtorr; Cooling the substrate temp.: Yes (Ts=5 C)
f. Thickness: 2087A /130s, rate: 16.05 A/s
g. Current: 1.7A
h. Tc = 9.2 K