Run #377 NbN deposition
Wafer : HRSi 2"/ HRSi chip
Mounting : with diffusion pump oil
RF-clean : Yes, only N2
Temp. of Sub.: RT
Ar/N2: 12 sccm/3.3 sccm; 7.4 mtorr
DC current/ volt./ Watt.: 1.75 A/364 V/ 0.63 W
Pre- deposit time: 300 sec.
Deposit time: 12 sec.
Thickness: 177.156 A (12 sec.); Deposit Rate: 14.76 A/s
The critical Temp (Tc): 10.3 K (20160524)