NbN deposition
1.Wafer : test chip (SiO2 (600nm)/Si), HR Si, Fused quartz, SiO2 (600nm)/Si
2.Wafer clean : no
3.Mounting : with diffusion pump oil
4.RF-clean : Yes, only N2
5.Working gas: Ar : 12 / N2 : 3.3 (SCCM), 7.7 mtorr
6.Thickness: 3518.4 A, rate: 17.59 A/s = 1.76 nm/s, 200 sec
7. I = 1.8A