1. NbN deposition
a. Wafer : test chip (SiO2 (600nm)/Si), HR Si-chip
b. Wafer clean : no
c. Mounting : with diffusion pump oil
d. RF-clean : Yes, only N2
e. Working gas: Ar : 12 / N2 : 3.3 (SCCM), 7.4 mtorr
f. Thickness~ 127.8 A, rate~ 14.206 A/s
g. Current: 1.7A
h. Tc = 8.96 K