Sample number: "IBD-106-NbN-SiC (Ag)-900C-30/3.3 sccm-2.4 mTorr-204mA-74 sec.-2017062201"
Background of the M.C. (Main chamber): 3.6*1e-8 torr
Substrate: 20"-BOE etched-3C-SiC/Si (10mmx10mm 3 pieces)
Mounting: Silver glue
Temp. of Sub. (set /after growth): 900/ 880 degree C
Ar/N2: 30 sccm/3.3 sccm
APC: set value of the APC position is 240 (the pressure shows 2.1-2.6 mTorr)
DC current/ volt./ Watt.: 204 mA/ 544 V/ 111 W
Pre- deposit time: 300 sec.
Deposit time: 74 sec.; Thickness: 3.7 nm
(Deposite rate of IBD-41 determined by HRTEM is 0.475 nm/sec)
The critical Temp of NbN film/etched SiC : Tc(R=0)=12.2 K; Tc(R=0.5R20K)=12.6 K