Run #343 NbN deposition
a. Wafer :SiO2/ testchip
b. Wafer clean : No
c. Mounting : with diffusion pump oil
d. RF-clean : Yes, only N2
e. Working gas: Ar : 12 / N2 : 3 (SCCM), 7.4 mtorr
f. Thickness: 2676 A; Deposit rate: 13.38 A/sec.
g. Current: 1.6 A
h. Tc=13.75