1. NbN deposition
a. Wafer : test chip (SiO2 (600nm)/Si), HR Si, Fused quartz, SiO2 (600nm)/Si
b. Wafer clean : no
c. Mounting : with diffusion pump oil
d. RF-clean : Yes, only N2
e. Working gas: Ar : 12 / N2 : 3.3 (SCCM), 7.4 mtorr
f. Thickness: 2850.4 A, rate: 14.25 A/s = 1.425 nm/s
g. Current: 1.7A
h. Tc = 14.3