NbN deposition
1.Wafer : test chip (SiO2 (600nm)/Si), HR Si, Fused quartz
2.Wafer clean : no
3.Mounting : with diffusion pump oil
4.RF-clean : Yes, only N2
5.Working gas: Ar : 12 / N2 : 3.0 (SCCM), 7.7 mtorr
6.Thickness: 3234 A, rate: 16.17 A/s = 1.61 nm/s, 200 sec
7. I = 1.7A