Run #342 NbN deposition
a. Wafer :SiO2/ testchip
b. Wafer clean : No
c. Mounting : with diffusion pump oil
d. RF-clean : Yes, only N2
e. Working gas: Ar : 12 / N2 : 3 (SCCM), 7.4 mtorr
f. Thickness: 200 sec. ( It's hard to measure the thickness, because the Au on the testchoip cannot be totally removed.)
g. Current: 1.75 A
h. Tc= 10.35 K