Rezumat

Acest capitol oferă o privire de ansamblu asupra rolului lipirii în ambalare electronică și a proceselor cheie de lipire. Conduse de preocupările de mediu legate de utilizarea plumbului și de implementarea legislativă pentru a interzice plumbul, materialele de lipit evoluează de la materiale care conțin plumb la cele fără plumb. În plus, aliaje de lipit la temperatură înaltă și aliaje de lipit compozite au fost dezvoltate în ultimii ani pentru a satisface cerințele mai dure de serviciu și funcționale ale interconexiunilor. De asemenea, sunt discutate caracteristicile cheie care sunt esențiale pentru fiabilitatea și fabricabilitatea materialelor de lipit. În cele din urmă, pentru a oferi o mai bună înțelegere a fiabilității materialelor de lipit în vrac și a îmbinărilor de lipit, sunt discutate, în acest capitol, studii de fiabilitate în ceea ce privește comportamentul mecanic, ciclul de temperatură și impactul picăturii.
This chapter provides an overview of the role of soldering in electronic packaging and the key soldering processes. Driven by environmental concerns of the use of lead and legislative implementation to ban lead, solder materials evolve from lead-containing to lead-free materials. Furthermore, high-temperature solders and composite solders are developed in recent years to cater to the harsher service and functional requirements of interconnects. The key characteristics which are critical to the reliability and manufacturability of solder materials are also discussed. Lastly, in order to provide a better understanding of the reliability of bulk solder materials and solder joints, reliability studies in terms of mechanical behavior, temperature cycling, and drop impact are discussed in this chapter.

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