Abstract

This chapter presents the solid-state bonding technologies, in particular the thermocompression bonding and thermosonic bonding technologies, which are used to form microjoints in the electronics industry. The diffusion bonding mechanism and the key bonding conditions required to form reliable joints are presented. Moreover, the recent progresses in the thermocompression bonding and thermosonic ball-wedge bonding technologies are highlighted. Lastly, the effects of different bonding materials and their surface characteristics on the joints’ performance are also discussed.