This chapter begins with an overview of the diffusion bonding mechanisms which are instrumental to the solid-state diffusion bonding process. The key bonding conditions which influence the formation of a strong and reliable diffusion joint are also discussed. Furthermore, the advancements in thermocompression bonding and thermosonic ball-wedge bonding are presented. In essence, the information provided in this chapter reflects that the solid-state microjoining technologies and the joints’ performance are closely related to the type of bonding materials (such as the interconnect bumps and bonding wires) and their surface characteristics.

Acknowledgement For section “Advances in the Manufacturing of Thermosonic Ball-Wedge Bonding,” the authors sincerely thank their fellow colleagues from R&D-APL, R&D-MCL, MTD, QA, and engineering divisions of Heraeus Materials Singapore Pte. Ltd. for the data collection.

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