Sharon Mui Ling Nai: Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology and Research (A*STAR), Singapore
Murali Sarangapani, Johnny Yeung: Heraeus Materials, Singapore
15.1 Introduction
15.2 Solid-State Diffusion Bonding
Mechanisms of Diffusion Bonding
Bonding Conditions
15.3 Advances in Thermocompression Bonding
Flip Chip Bonding
Wafer Bonding
15.4 Advances in the Manufacturing of Thermosonic Ball-Wedge Bonding
Current Trend of Thermosonic Bonding
Properties of Thermosonic Bonding Wires
Surface Characterization of Bonding Wire, Bond Pad, and Lead Finger
Thermosonic Bonding Process
Future Trends
15.5 Summary, References
Abstract
This chapter presents the solid-state bonding technologies, in particular the thermocompression bonding and thermosonic bonding technologies, which are used to form microjoints in the electronics industry. The diffusion bonding mechanism and the key bonding conditions required to form reliable joints are presented. Moreover, the recent progresses in the thermocompression bonding and thermosonic ball-wedge bonding technologies are highlighted. Lastly, the effects of different bonding materials and their surface characteristics on the joints’ performance are also discussed.