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Research Highlights
Research Highlights
Simultaneous detection of two growth factors from human single-embryo culture medium by a bead-based digital microfluidic chip
Simultaneous detection of two growth factors from human single-embryo culture medium by a bead-based digital microfluidic chip
1.Two growth factors from the same single human embryo culture medium droplet are successfully detected for the first time.
1.Two growth factors from the same single human embryo culture medium droplet are successfully detected for the first time.
2.The proposed chip achieves low sample volume demand, short total process time, and the low limit of detection.
3.Embryos with similar normal morphology during culture period, some growth factors may change evidently, such as IL-1β.
[Impact factor:9.518 Chemistry,Analytical rank: 1/84 (1.2%)]
References
[1] M.-S. Lee, W. Hsu, H.-Y. Huang, H.-Y. Tseng, C.-T. Lee, C.-Y. Hsu,Y.-C. Hsieh,S.-H.Wang,D.-J. Yao and C.-H.Liu, "Simultaneous detection of two growth factors from human single-embryo culture medium by a bead-based digital microfluidic chip," Journal of Biosensors and Bioelectronics 2020, 150 ,111581
[1] M.-S. Lee, W. Hsu, H.-Y. Huang, H.-Y. Tseng, C.-T. Lee, C.-Y. Hsu,Y.-C. Hsieh,S.-H.Wang,D.-J. Yao and C.-H.Liu, "Simultaneous detection of two growth factors from human single-embryo culture medium by a bead-based digital microfluidic chip," Journal of Biosensors and Bioelectronics 2020, 150 ,111581
大面積電極式多點觸覺刺激裝置之可行性研究
大面積電極式多點觸覺刺激裝置之可行性研究
本研究製作出同時兼具多點控制與大面積兩優點的觸覺刺激裝置，旨在解決傳統式電極刺激裝置無法於手持行動裝置上多點控制之缺點，此改進將有助於提升與手持行動裝置之可行性。相較於傳統式電極刺激裝置，本研究具備更佳觸覺刺激單元之解析度，可同時間同平面各點獨立產生觸覺且兼具大面積優點。
Double-side multiple partial exposure (DoMPE)
Double-side multiple partial exposure (DoMPE)
Based on standard lithography technology, the DoMPE method could enhance the fabrication capability of three dimensional (3D) photoresist microstructures. By incorporating gray-tone lithography and double-side exposure techniques, the DoMPE scheme extends the multi-level morphology on both the front side and backside of the suspended photoresist microstructures. Backside gray-tone lithography is achieved by depositing various appropriate thicknesses of metal film on glass substrate that acts as the gray-tone mask. A microinductor structure, a vertical comb drive structure, and an embedded microstructure with asymmetric inside cross section are successfully fabricated by DoMPE method to demonstrate potential applications.
Based on standard lithography technology, the DoMPE method could enhance the fabrication capability of three dimensional (3D) photoresist microstructures. By incorporating gray-tone lithography and double-side exposure techniques, the DoMPE scheme extends the multi-level morphology on both the front side and backside of the suspended photoresist microstructures. Backside gray-tone lithography is achieved by depositing various appropriate thicknesses of metal film on glass substrate that acts as the gray-tone mask. A microinductor structure, a vertical comb drive structure, and an embedded microstructure with asymmetric inside cross section are successfully fabricated by DoMPE method to demonstrate potential applications.
References
[1] J. Chung, and W. Hsu, "Enhancement on forming complex three dimensional microstructures by a double-side multiple partial exposure method." Journal of Vacuum Science and Technology B 2007, 25, 1671.
[1] J. Chung, and W. Hsu, "Enhancement on forming complex three dimensional microstructures by a double-side multiple partial exposure method." Journal of Vacuum Science and Technology B 2007, 25, 1671.
[2] J. Chung, W. Hsu, "Fabrication of a polymer-based torsional vertical comb drive using a double-side partial exposure method." Journal of Micromechanics and Microengineering 2008, 18, 035014.
[2] J. Chung, W. Hsu, "Fabrication of a polymer-based torsional vertical comb drive using a double-side partial exposure method." Journal of Micromechanics and Microengineering 2008, 18, 035014.
[3] Y.-T. Huang and W. Hsu, “A Simulation Model on Photoresist SU-8 Thickness after Development under Partial Exposure with Reflection Effect.” Japanese Journal of Applied Physics 2014, 53, 036505.
[3] Y.-T. Huang and W. Hsu, “A Simulation Model on Photoresist SU-8 Thickness after Development under Partial Exposure with Reflection Effect.” Japanese Journal of Applied Physics 2014, 53, 036505.
[4] Y.-T. Huang and W. Hsu, “Fabricating embedded SU-8 microstructures with asymmetric inside cross section by double-side multiplepartial exposure method.” Microelectronic Engineering 2014, 121, 64-67.
[4] Y.-T. Huang and W. Hsu, “Fabricating embedded SU-8 microstructures with asymmetric inside cross section by double-side multiplepartial exposure method.” Microelectronic Engineering 2014, 121, 64-67.
3D micro assembly by micro resistance welding
3D micro assembly by micro resistance welding
The three-dimensional micro assembly of hinged nickel micro devices by magnetic lifting and micro resistance welding is proposed here. By an electroplating-based surface machining process, the released nickel structure with the hinge mechanism can be fabricated. Lifting of the released micro structure to different tilted angles is accomplished by controlling the positions of a magnet beneath the device. An in situ electro-thermal actuator is used to provide the pressing force in micro resistance welding for immobilizing the tilted structure. The micro devices are shown to be immobilized at controlled angles ranging from 14◦ to 90◦. Finally, a lifted and immobilized electro-thermal bent-beam actuator is shown to displace upward about 27.7 μm with 0.56 W power input to demonstrate the capability of electrical transmission at welded joints by the proposed 3D micro assembly technique.
The three-dimensional micro assembly of hinged nickel micro devices by magnetic lifting and micro resistance welding is proposed here. By an electroplating-based surface machining process, the released nickel structure with the hinge mechanism can be fabricated. Lifting of the released micro structure to different tilted angles is accomplished by controlling the positions of a magnet beneath the device. An in situ electro-thermal actuator is used to provide the pressing force in micro resistance welding for immobilizing the tilted structure. The micro devices are shown to be immobilized at controlled angles ranging from 14◦ to 90◦. Finally, a lifted and immobilized electro-thermal bent-beam actuator is shown to displace upward about 27.7 μm with 0.56 W power input to demonstrate the capability of electrical transmission at welded joints by the proposed 3D micro assembly technique.
References
[1] C.-W. Chang, C.-C. Yeh and W. Hsu, "Experimental investigations and characterization of micro resistance welding with an electro-thermal actuator." Journal of Micromechanics and Microengineering 2009, 19, 025001.
[1] C.-W. Chang, C.-C. Yeh and W. Hsu, "Experimental investigations and characterization of micro resistance welding with an electro-thermal actuator." Journal of Micromechanics and Microengineering 2009, 19, 025001.
[2] C.-W. Chang, W. Hsu, "Three-dimensional micro assembly of a hinged nickel micro device by magnetic lifting and micro resistance welding." Journal of Micromechanics and Microengineering 2009, 19, 105026.
[2] C.-W. Chang, W. Hsu, "Three-dimensional micro assembly of a hinged nickel micro device by magnetic lifting and micro resistance welding." Journal of Micromechanics and Microengineering 2009, 19, 105026.
Droplet-on-a-wristband
Droplet-on-a-wristband
With the proposed “plug-and-play” interfaces, various digital microfluidic modules can be easily assembled and disassembled, which can be used to form a complex microfludic system even integrations. Droplets are manipulated by electrowetting in a wristband-like platform consisting two flexible modules, a basic connecting module, and an I/O connecting module. Here a wristband-like droplet platform is successfully demonstrated by combining modulation and flexible substrate techniques. A droplet is shown to move smoothly on the platform with speed around 105.7 mm/s.
With the proposed “plug-and-play” interfaces, various digital microfluidic modules can be easily assembled and disassembled, which can be used to form a complex microfludic system even integrations. Droplets are manipulated by electrowetting in a wristband-like platform consisting two flexible modules, a basic connecting module, and an I/O connecting module. Here a wristband-like droplet platform is successfully demonstrated by combining modulation and flexible substrate techniques. A droplet is shown to move smoothly on the platform with speed around 105.7 mm/s.
References
References
[1] H. Yang, S.-K. Fan, and W. Hsu (November 2005). 3D Droplet Transportation by EWOD Actuations on Flexible Polymer Films, ASME 2005 International Mechanical Engineering Congress and Exposition, Orlando, U.S.A..
[1] H. Yang, S.-K. Fan, and W. Hsu (November 2005). 3D Droplet Transportation by EWOD Actuations on Flexible Polymer Films, ASME 2005 International Mechanical Engineering Congress and Exposition, Orlando, U.S.A..
[2] S.-K. Fan, H. Yang, T.-T. Wang, and W. Hsu, "Asymmetric Electrowetting - Moving Droplets by a Square Wave." Lab on a Chip 2007, 7, 1330-1335.
[2] S.-K. Fan, H. Yang, T.-T. Wang, and W. Hsu, "Asymmetric Electrowetting - Moving Droplets by a Square Wave." Lab on a Chip 2007, 7, 1330-1335.
[3] S.-K. Fan, H. Yang and W. Hsu, "Droplet-on-a-Wristband: Chip-to-Chip Digital Microfluidic Interfaces between Replaceable and Flexible Electrowetting Modules." Lab on a Chip 2011, 11, 343–347.
[3] S.-K. Fan, H. Yang and W. Hsu, "Droplet-on-a-Wristband: Chip-to-Chip Digital Microfluidic Interfaces between Replaceable and Flexible Electrowetting Modules." Lab on a Chip 2011, 11, 343–347.
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