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楊佳曄 (Chia-Yeh Yang)
楊佳曄 (Chia-Yeh Yang)
The Investigation of Surface Roughness Effects for Reliable Hermetic Nanopackaging
The Investigation of Surface Roughness Effects for Reliable Hermetic Nanopackaging
表面粗糙度對奈米級封裝的效應研究
表面粗糙度對奈米級封裝的效應研究
In order to package the nano devices and resolve the process complexity of fabrications, this research investigates the surface roughness effects on UV curable adhesive for nanopackaging.
In order to package the nano devices and resolve the process complexity of fabrications, this research investigates the surface roughness effects on UV curable adhesive for nanopackaging.
The UV curable adhesive is cured through UV light exposure without any additional heating, suitable for packaging the devices with temperature sensitive materials or processes. On the other hand, the addition of surface roughness increases bonding area of UV curable adhesive and enhances bonding strength. The packaging size can be reduced effectively.
The UV curable adhesive is cured through UV light exposure without any additional heating, suitable for packaging the devices with temperature sensitive materials or processes. On the other hand, the addition of surface roughness increases bonding area of UV curable adhesive and enhances bonding strength. The packaging size can be reduced effectively.
At first, the surface roughness of Si wafer is modified by photoresist spin and RIE etching. The Ra before and after modification are 0.4nm and 12.4nm respectively. Then shells are fabricated by RIE etching and the bonding width is 2μm and 4μm. Finally UV curable adhesive is spun on Pyrex7740 and cured through UV light exposure to bond to Si wafers.
At first, the surface roughness of Si wafer is modified by photoresist spin and RIE etching. The Ra before and after modification are 0.4nm and 12.4nm respectively. Then shells are fabricated by RIE etching and the bonding width is 2μm and 4μm. Finally UV curable adhesive is spun on Pyrex7740 and cured through UV light exposure to bond to Si wafers.
The packaging hermeticity and strength are evaluated. The addition of surface roughness reduces leakage from 3％ to 8％ and enhances bonding strength from 35％ to 43％. The surface roughness effects on UV curable adhesive for nonopackaging are achieved by the results of decreasing packaging size, increasing bonding strength, and under room temperature process. In addition, the backside of Si wafers is unpolished and used to experiment. The Ra 0.6μm generates residual photoresist and results in fabrication failure during lithography process. Such high surface roughness is unsuitable to integrate in fabrication processes.
The packaging hermeticity and strength are evaluated. The addition of surface roughness reduces leakage from 3％ to 8％ and enhances bonding strength from 35％ to 43％. The surface roughness effects on UV curable adhesive for nonopackaging are achieved by the results of decreasing packaging size, increasing bonding strength, and under room temperature process. In addition, the backside of Si wafers is unpolished and used to experiment. The Ra 0.6μm generates residual photoresist and results in fabrication failure during lithography process. Such high surface roughness is unsuitable to integrate in fabrication processes.
[1] C.-Y. Yang, Y.-T. Cheng and W. Hsu, (January 2006). Nano-Roughening for Reliable N/MEMS Manufacture, The 1st Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Zhuhai, China
[2] C.-Y. Yang, Y.-T. Cheng and W. Hsu, "The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application." IEEE Transactions on Advanced Packaging 2010, 33, 356-361.
[2] C.-Y. Yang, Y.-T. Cheng and W. Hsu, "The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application." IEEE Transactions on Advanced Packaging 2010, 33, 356-361.
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