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鍾君煒 (Junwei Chung)
鍾君煒 (Junwei Chung)
Fabrication of Micromachined Microwave Switches
Fabrication of Micromachined Microwave Switches
微機械微波開關之製程研究
微機械微波開關之製程研究
A surface micromachined microwave switch has been made on silicon substrate, which is vertically actuated by electrostatic mechanism. The suspended arm and plate are constructed by electroplated nickel layer, the gold film patterned by lift-off method forms the lower electrode and signal line, and the Si3N4 is deposited as dielectric layer. Different sacrificial layer materials are tested, and the use of Cu as sacrificial layer and Ni as structure layer performs the successful fabrication process.
A surface micromachined microwave switch has been made on silicon substrate, which is vertically actuated by electrostatic mechanism. The suspended arm and plate are constructed by electroplated nickel layer, the gold film patterned by lift-off method forms the lower electrode and signal line, and the Si3N4 is deposited as dielectric layer. Different sacrificial layer materials are tested, and the use of Cu as sacrificial layer and Ni as structure layer performs the successful fabrication process.
Two different configurations of microwave switch, cantilever plate and cantilever plate with torsion beam, are designed and fabricated, which have actuation voltage 2.3 ~ 7.6V and 16.5 ~ 20.5V, respectively. By the shunt-mounted, a microwave signal is switched ON and OFF when the suspended signal switching plate is actuated up and down. The insertion loss of -3.0 ~ -4.0dB from 2GHz to 20GHz is obtained. The isolation below -45dB between 0.1GHz and 20GHz for two switches mounted on one CPW is measured.
Two different configurations of microwave switch, cantilever plate and cantilever plate with torsion beam, are designed and fabricated, which have actuation voltage 2.3 ~ 7.6V and 16.5 ~ 20.5V, respectively. By the shunt-mounted, a microwave signal is switched ON and OFF when the suspended signal switching plate is actuated up and down. The insertion loss of -3.0 ~ -4.0dB from 2GHz to 20GHz is obtained. The isolation below -45dB between 0.1GHz and 20GHz for two switches mounted on one CPW is measured.
[1] J. Chung and W. Hsu (August 2002). Sacrificial Layer Process for the Suspended Metal Structures in electrostatic Switch Application, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Chia-Yi, Taiwan.
[2] J. Chung and W. Hsu (August 2002). Micromachined I-Shape Cantilever Beam, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Chia-yi, Taiwan.
[2] J. Chung and W. Hsu (August 2002). Micromachined I-Shape Cantilever Beam, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Chia-yi, Taiwan.
[3] C.-C. Yeh, J. Chung, C.-W. Chang and W. Hsu (January 2007). Micro Assembly by Micro Resistance Welding with Electro-Thermal Actuators, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[3] C.-C. Yeh, J. Chung, C.-W. Chang and W. Hsu (January 2007). Micro Assembly by Micro Resistance Welding with Electro-Thermal Actuators, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[4] C.-S. Huang, J. Chung, Y.-T. Cheng and W. Hsu (January 2007). Thermal Bimetallic Microactuators by Ni and Ni-diamond Nanocomposite, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[4] C.-S. Huang, J. Chung, Y.-T. Cheng and W. Hsu (January 2007). Thermal Bimetallic Microactuators by Ni and Ni-diamond Nanocomposite, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[5] J. Chung and W. Hsu (January 2007). Fabrication of 3D Photoresist Microstructures for the Polymer Vertical Comb Drive, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[5] J. Chung and W. Hsu (January 2007). Fabrication of 3D Photoresist Microstructures for the Polymer Vertical Comb Drive, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[6] J. Chung, and W. Hsu, "Enhancement on forming complex three dimensional microstructures by adouble-side multiple partial exposure method." Journal of Vacuum Science and Technology B 2007, 25, 1671.
[6] J. Chung, and W. Hsu, "Enhancement on forming complex three dimensional microstructures by adouble-side multiple partial exposure method." Journal of Vacuum Science and Technology B 2007, 25, 1671.
[7] J. Chung, W. Hsu, "Fabrication of a polymer-based torsional vertical comb drive using a double-side partial exposure method." Journal of Micromechanics and Microengineering 2008, 18, 035014.
[7] J. Chung, W. Hsu, "Fabrication of a polymer-based torsional vertical comb drive using a double-side partial exposure method." Journal of Micromechanics and Microengineering 2008, 18, 035014.
[8] J. Chung, Y.-C. Lee, and W. Hsu (January 2008). Fabrication of polymer-based vertical comb drive using a double-side multiple partial exposure method, The 21th IEEE International Conference on Micro Electro Mechanical Systems, Tucson, U.S.A..
[8] J. Chung, Y.-C. Lee, and W. Hsu (January 2008). Fabrication of polymer-based vertical comb drive using a double-side multiple partial exposure method, The 21th IEEE International Conference on Micro Electro Mechanical Systems, Tucson, U.S.A..
[9] C.-S. Huang, Y.-T. Cheng, J. Chung and W. Hsu, 2009, "Investigation of Ni-based Thermal Bimaterial Structure for Sensor and Actuator Application." Sensors and Actuators :A 2009, 149, 298-304.
[9] C.-S. Huang, Y.-T. Cheng, J. Chung and W. Hsu, 2009, "Investigation of Ni-based Thermal Bimaterial Structure for Sensor and Actuator Application." Sensors and Actuators :A 2009, 149, 298-304.
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