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李政璋 (Cheng-Chang Lee)
李政璋 (Cheng-Chang Lee)
New Modification Processes on Surface Roughness and Their Application to Anti-stiction
New Modification Processes on Surface Roughness and Their Application to Anti-stiction
新式表面粗糙化製程及其在微結構抗沾黏之研究
新式表面粗糙化製程及其在微結構抗沾黏之研究
Many processes about modification on surface roughness have been developed previously for various applications. However, the modified materials in the previously reported methods were designed for specific materials, especially for silicon-type materials, and some had the particular requirements.
Many processes about modification on surface roughness have been developed previously for various applications. However, the modified materials in the previously reported methods were designed for specific materials, especially for silicon-type materials, and some had the particular requirements.
Here, two methods that can apply surface roughness modification to most materials of MEMS are proposed. One is to combine spin-on photoresist and one-step RIE, and the other is to use spin-on photoresist and two-step etching processes. Both are the low temperature processes, and they have no special requirement for material properties and no extra mask is needed. Therefore, there is more flexibility to add the modification to the original fabrication processes of the microdevices. In this study, the modified surfaces are used to alleviate stiction of microstructures, and the related recipes are developed for the anti-stiction application. According to characterization results with the cantilever beam array (CBA), the method with one-step RIE can obtain about 2 times longer detachment lengths than those without the modified substrate, and the other method is 2.6 times longer. Besides, the other simpler strategies, measuring water contact angles and surface roughness, are used to determine the proper modification time of the two methods, respectively.
Here, two methods that can apply surface roughness modification to most materials of MEMS are proposed. One is to combine spin-on photoresist and one-step RIE, and the other is to use spin-on photoresist and two-step etching processes. Both are the low temperature processes, and they have no special requirement for material properties and no extra mask is needed. Therefore, there is more flexibility to add the modification to the original fabrication processes of the microdevices. In this study, the modified surfaces are used to alleviate stiction of microstructures, and the related recipes are developed for the anti-stiction application. According to characterization results with the cantilever beam array (CBA), the method with one-step RIE can obtain about 2 times longer detachment lengths than those without the modified substrate, and the other method is 2.6 times longer. Besides, the other simpler strategies, measuring water contact angles and surface roughness, are used to determine the proper modification time of the two methods, respectively.
[1] C. C. Lee and W. Hsu (March 2001). Optimization of an Electro-thermally and Laterally Driven Microactuator, Micro System Technologies, Dusseldorf, Germany.
[1] C. C. Lee and W. Hsu (March 2001). Optimization of an Electro-thermally and Laterally Driven Microactuator, Micro System Technologies, Dusseldorf, Germany.
[2] C. C. Lee and W. Hsu (November 2002). A New Surface Modification Method to Alleviate Stiction of Microstructures, ASME International Mechanical Engineering Congress and Exposition New Orleans, U.S.A..
[2] C. C. Lee and W. Hsu (November 2002). A New Surface Modification Method to Alleviate Stiction of Microstructures, ASME International Mechanical Engineering Congress and Exposition New Orleans, U.S.A..
[3] C. C. Lee and W. Hsu (May 2003). Modification on surface roughness by combining dry and wet etching, SPIE International Symposium on Microtechnologies for the New Millennium 2003, Gran Canaria, Spain.
[3] C. C. Lee and W. Hsu (May 2003). Modification on surface roughness by combining dry and wet etching, SPIE International Symposium on Microtechnologies for the New Millennium 2003, Gran Canaria, Spain.
[4] C.-C. Lee and W. Hsu, "Method on surface roughness modification to alleviate stiction of microstructures." Journal of Vacuum Science and Technology B 2003, 21, 1505.
[4] C.-C. Lee and W. Hsu, "Method on surface roughness modification to alleviate stiction of microstructures." Journal of Vacuum Science and Technology B 2003, 21, 1505.
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