Here, two methods that can apply surface roughness modification to most materials of MEMS are proposed. One is to combine spin-on photoresist and one-step RIE, and the other is to use spin-on photoresist and two-step etching processes. Both are the low temperature processes, and they have no special requirement for material properties and no extra mask is needed. Therefore, there is more flexibility to add the modification to the original fabrication processes of the microdevices. In this study, the modified surfaces are used to alleviate stiction of microstructures, and the related recipes are developed for the anti-stiction application. According to characterization results with the cantilever beam array (CBA), the method with one-step RIE can obtain about 2 times longer detachment lengths than those without the modified substrate, and the other method is 2.6 times longer. Besides, the other simpler strategies, measuring water contact angles and surface roughness, are used to determine the proper modification time of the two methods, respectively.