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鍾君煒 (Junwei Chung)
鍾君煒 (Junwei Chung)
Novel Fabrication Schemes for Non-Silicon-Based Vertical Comb Drive
Novel Fabrication Schemes for Non-Silicon-Based Vertical Comb Drive
非矽基垂直式梳狀元件之製程研究
非矽基垂直式梳狀元件之製程研究
In recent MEMS research, vertical comb drives (VCDs) have attracted lots of attention due to their superior characteristics in out-of-plane motion. To date, all the reported VCDs were fabricated by silicon-based micromachining with using silicon as the structural material, and exhibit a high cost solution with the DRIE process and the mainly required SOI-wafers. In contrast to silicon, the metals and polymers are becoming attractively alternative materials for fabricating the low cost micro devices and components to their silicon or glass-based counterparts. However, no polymer or metal-based VCDs have been reported yet.
In recent MEMS research, vertical comb drives (VCDs) have attracted lots of attention due to their superior characteristics in out-of-plane motion. To date, all the reported VCDs were fabricated by silicon-based micromachining with using silicon as the structural material, and exhibit a high cost solution with the DRIE process and the mainly required SOI-wafers. In contrast to silicon, the metals and polymers are becoming attractively alternative materials for fabricating the low cost micro devices and components to their silicon or glass-based counterparts. However, no polymer or metal-based VCDs have been reported yet.
In this dissertation, novel fabrication methods are proposed to fabricate the VCDs in different materials―polymer and metal. Both of them are low temperature and low cost techniques, and provide a flexible and affordable solution with the basic equipment of LIGA-like process. First, the operation model of VCD is performed with theoretical analysis and FEM simulation for dimensional design. For the fabrication of polymer-based VCD, the double-side multiple partial exposure (DoMPE) method is developed to extend the multi-level morphology on both the front and back sides of the suspended photoresist microstructures. Depending on the established processing data, different 3D photoresist microstructures made of photoresist AZ9260® are successfully demonstrated, as well as the polymer-based VCD. By comparing the analytical and experimental results, the feasibility on fabricating polymer-based VCD is verified.
In this dissertation, novel fabrication methods are proposed to fabricate the VCDs in different materials―polymer and metal. Both of them are low temperature and low cost techniques, and provide a flexible and affordable solution with the basic equipment of LIGA-like process. First, the operation model of VCD is performed with theoretical analysis and FEM simulation for dimensional design. For the fabrication of polymer-based VCD, the double-side multiple partial exposure (DoMPE) method is developed to extend the multi-level morphology on both the front and back sides of the suspended photoresist microstructures. Depending on the established processing data, different 3D photoresist microstructures made of photoresist AZ9260® are successfully demonstrated, as well as the polymer-based VCD. By comparing the analytical and experimental results, the feasibility on fabricating polymer-based VCD is verified.
For the fabrication of metal-based VCD, the properties of electroplated nickel are first characterized with different thicknesses and current densities, and obvious variations on material properties are observed, which would be helpful in designing micro devices by using electroplated nickel as structural material. To fabricate the metal-based VCD, electroplated nickel and copper are used as the structural and sacrificial layers. By electrodepositing nickel and copper in turn with thick photoresist as the molds, the VCD structures are constructed with the final release performed by wet etching. Also, the VCD with angled fingers could be further realized by controlling the angle of photoresist sidewall by this approach.
For the fabrication of metal-based VCD, the properties of electroplated nickel are first characterized with different thicknesses and current densities, and obvious variations on material properties are observed, which would be helpful in designing micro devices by using electroplated nickel as structural material. To fabricate the metal-based VCD, electroplated nickel and copper are used as the structural and sacrificial layers. By electrodepositing nickel and copper in turn with thick photoresist as the molds, the VCD structures are constructed with the final release performed by wet etching. Also, the VCD with angled fingers could be further realized by controlling the angle of photoresist sidewall by this approach.
[1] J. Chung and W. Hsu (August 2002). Micromachined I-Shape Cantilever Beam, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Chia-yi, Taiwan.
[1] J. Chung and W. Hsu (August 2002). Micromachined I-Shape Cantilever Beam, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Chia-yi, Taiwan.
[2] J. Chung and W. Hsu (August 2002). Sacrificial Layer Process for the Suspended Metal Structures in electrostatic Switch Application, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Chia-Yi, Taiwan.
[2] J. Chung and W. Hsu (August 2002). Sacrificial Layer Process for the Suspended Metal Structures in electrostatic Switch Application, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Chia-Yi, Taiwan.
[3] C.-S. Huang, J. Chung, Y.-T. Cheng and W. Hsu (January 2007). Thermal Bimetallic Microactuators by Ni and Ni-diamond Nanocomposite, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[3] C.-S. Huang, J. Chung, Y.-T. Cheng and W. Hsu (January 2007). Thermal Bimetallic Microactuators by Ni and Ni-diamond Nanocomposite, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[4] C.-C. Yeh, J. Chung, C.-W. Chang and W. Hsu (January 2007). Micro Assembly by Micro Resistance Welding with Electro-Thermal Actuators, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[4] C.-C. Yeh, J. Chung, C.-W. Chang and W. Hsu (January 2007). Micro Assembly by Micro Resistance Welding with Electro-Thermal Actuators, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[5] J. Chung and W. Hsu (January 2007). Fabrication of 3D Photoresist Microstructures for the Polymer Vertical Comb Drive, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[5] J. Chung and W. Hsu (January 2007). Fabrication of 3D Photoresist Microstructures for the Polymer Vertical Comb Drive, The 2nd Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand.
[6] J. Chung, and W. Hsu, "Enhancement on forming complex three dimensional microstructures by adouble-side multiple partial exposure method." Journal of Vacuum Science and Technology B 2007, 25, 1671.
[7] J. Chung, Y.-C. Lee, and W. Hsu (January 2008). Fabrication of polymer-based vertical comb drive using a double-side multiple partial exposure method, The 21th IEEE International Conference on Micro Electro Mechanical Systems, Tucson, U.S.A..
[7] J. Chung, Y.-C. Lee, and W. Hsu (January 2008). Fabrication of polymer-based vertical comb drive using a double-side multiple partial exposure method, The 21th IEEE International Conference on Micro Electro Mechanical Systems, Tucson, U.S.A..
[8] J. Chung, W. Hsu, "Fabrication of a polymer-based torsional vertical comb drive using a double-side partial exposure method." Journal of Micromechanics and Microengineering 2008, 18, 035014.
[8] J. Chung, W. Hsu, "Fabrication of a polymer-based torsional vertical comb drive using a double-side partial exposure method." Journal of Micromechanics and Microengineering 2008, 18, 035014.
[9] C.-S. Huang, Y.-T. Cheng, J. Chung and W. Hsu, 2009, "Investigation of Ni-based Thermal Bimaterial Structure for Sensor and Actuator Application." Sensors and Actuators :A 2009, 149, 298-304.
[9] C.-S. Huang, Y.-T. Cheng, J. Chung and W. Hsu, 2009, "Investigation of Ni-based Thermal Bimaterial Structure for Sensor and Actuator Application." Sensors and Actuators :A 2009, 149, 298-304.
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