There is a dicing saw we can use in Prof Sandy Cochran's lab in JWS
Several mechanical workshop technicians (Denis Kearns team) are now trained to use the dicing saw (Wilson McDougall, Alastair MacFarlane, Steven Monaghan)
Put in a job request to Denis then contact him x4306 about scheduling
For dicing, spin photoresist on the chip and bake. For small chips, make sure they are stuck down securely.
The standard blade is for Si wafers. If you are planning to dice something hard (eg sapphire) you may need to purchase a diamond blade.
If Sandy's saw is unavailable there is a dicing saw in Physics and Astronomy but it is hard to get access.
OptoCap in Livingstone offer a commercial service. This is a good option if you are in a hurry. You may need to drive to Livingstone and deliver the chips.
From: Sandy Cochran
Sent: 28 March 2019 20:52
To: Robert Hadfield <Robert.Hadfield@glasgow.ac.uk>
Cc: Jharna Paul <Jharna.Paul@glasgow.ac.uk>; ARJIN BOONRUANG (student) <2411978B@student.gla.ac.uk>; Denis Kearns <Denis.Kearns@glasgow.ac.uk>; Nicola Fenu (student) <n.fenu.1@research.gla.ac.uk>
Subject: RE: Chip dicing
Dear Robert,
You can now request our saw to be used via the Mechanical Workshop – technicians there were trained in its use recently. I suggest you contact Denis Kearns (cced) about this directly, as the arrangement is just starting up.
Please note that Arjin is presently in Thailand toasting in the sunshine. However, Nico Fenu (also cced) is available in Glasgow should oversight be needed.
Kind regards,
Sandy.
Sandy Cochran, MIU: Medical and Industrial Ultrasonics
+44 141 330 3317 / +44 7967 202627