Please join the Slack channel "ex_sputter-machine" in order to share information about sputter machine.
The reservation system with Google calendar started on 2021.05.18.
Recently, shutdown of the circulating cooling water system in B11A1 occurred frequently, which is likely due to too much heat load. In B11A, especially large heat sources (cooling targets) are two vacuum pumps at Kinefuchi Lab, an ebeam evaporator at Shiomi Lab, and our sputtering machine. The pumps at the Kinefuchi Lab will always be running, and any other cooling would increase the risk of cooling system shutdown. So, when you use our sputtering machine, please let people know via this mailing list when (like *-** pm) you use the machine.
Also, the cooling water is only needed during the deposition (when the RF power is on). Please avoid opening valves when you just pumping down the chamber (e.g. after target change).
最近B11A1実験室で循環冷却水のキャパオーバーと思われる装置停止が頻発しています．あの部屋において，特に大きな大きな発熱源（冷却対象）は杵淵研のポンプ2台と塩見研の電子線蒸着装置，それから丸山研のスパッタリング装置です．うち，杵淵研のポンプは常時運転で，それ以外に冷却すると装置が停止するリスクが上がります．なので，うちのスパッタ装置を使う際には際にはこのメーリングリストで装置を使う時間帯を知らせて使用するようにしてください．なお，RF電源を動かすとき（＝堆積中）のみ冷却が必要のため，単に真空引きするだけなら冷却水を流す必要はありません．
Posted on 2023.07.27 by Otsuka
Please make notes on the reservation calendar about
what metal (oxide) you deposit when you do deposition,
which targets you are going to set on three cathodes when you do target change even if you keep some targets unchanged.
(Ex.) *17:00-18:00 Maruyuama Target change: CA1:Ti CA2:Pt CA3:Co
(Ex.) *10:00-13:00 Maruyama Ti Pt
!!Bad example--> *17:00-18:00 Maruyuama Target change CA1 to Co (<--It is difficult to trace the present setting of three targets. Please write down all three targets every time!!)
PLEASE take good care of the shutter!
ESPECIALLY when you want to take out the shield cover and earth shield, DO NOT collide with the shutter!
ESPECIALLY when you want to open the shutter to deposit, DO NOT use too strong force to cause the shutter collide with the wall!
2021/01/13 Filter and flow meter are installed behind the machine to prevent clogging of cooling water pipes. Open the inlet valve near ceiling only one rotation and make sure the flow rate is ~2.5 L/min. otsuka
2021/01/04 Cooling water (and pipes) are carefully cleansed again. You can use the machine. A flow meter will be installed very soon. otsuka
2020/12/29 The screens of the RF controllers do not turn on when cooling water is started. Sugihara
2020/11/09 Cooling water was discharged twice from the blue pipes to get rid of (presumably) clogged sediment. After overnight running of the cooling water, the RF power units are stably working. Chiashi, Date, Otsuka, Feng.
2020/11/02 RF power units are unstable due to cooling water problem. Nagaya, Otsuka
2020/03/05 Sensor of IG1 was changed to new one. Seo, Inoue
2019/06/04 SiO2 target was found to be used up. New one was ordered. -->06/26 New one arrived. Inoue, Igimi
2018
12/17 Manuals were updated (minor change). Inoue
7/23 Pt target was used up and changed to new one. Wang, Inoue
6/8 The holes of Fe, Pt, SiO2 need to be enlarged to M4. qian
4/16 New Al2O3 target is available. Screw holes of the CA3 base were broken. It may be better to use only CA1 and CA2, although CA3 is still available without countersunk screws. Please ask Qian Yang if you want to use CA3. Inoue
4/3 Al2O3 target on CA3 was found to be broken into two pieces. Probably, incorrect attachment of target caused excessive heating (Al2O3 contacted cap parts?). Al2O3 target is unavailable. New one was ordered. Inoue
4/2 Pressure gauge of main chamber is out of order. --> Disassembled and cleaned by Qian. Okay now.
2/8 Two screws fell from the top of the sample up-down system. They were fixed. Please use the sample up-down system carefully. Inoue, Shingyo
1/29 Clockwise is closing the valve! If you find the valve is too tight to open, this is because it is opened too much. So please try to close it firstly. Qian
Sputtering (updated on 2018/12/17)
Target change (updated on 2018/12/13)
Reverse sputtering (updated on 2018/12/13)
The value of IG1 does not decreases under xxE-2Pa even with a few hour pumping. --> This is probably due to contamination of the sensor of IG1. The actual pressure should be much lower. It is okay to conduct sputter deposition. After sputtering (plasma generation), sometimes the senor is spontaneously cleaned and recovered. It would be better to clean the sensor by disassembling it (It takes ~one hour. Ask someone.)
Sputtering system. Maker: Ulvac-Riko (アルバック理工，現:アドバンス理工). Product code: C-400-2C-APD-1S. Cathode: three sputter cathodes (CA1, 2, 3) and one arc plasma deposition cathode (APD). Reverse-sputtering (plasma etching of substrates) is available in the sub-chamber. Sputter power: up to 200W. Substrate size: up to φ2inch. Vacuum: two TMPs and one scroll pump (Main chamber ~1E-5Pa). Gas: Ar and O2 for deposition and N2 for chamber open (Ar-MFC:0-30sccm, O2-MFC:0-10sccm).
Target materials which we have: Al, Al2O3, Au, C, Co, Cr, Cu, Fe, Mo, MoO3, Ni, Pd, Pt, Si, SiO2, SnO2, Ti, TiO2, W, Zn, ZnO. APD target:Fe.
(*Spares of Pt and Pd targets are kept by lab staffs. 2018/01)