CMOS technology enabled fully flexible body vital monitor for wearable electronic applications
Flexible version of bulk monocrystalline silicon (100) can present significant advantages and a critical step in monolithic heterogeneous on-chip integration needed for IoT devices specially focusing on advanced healthcare. Therefore, we demonstrated state-of-the-art CMOS compatible large-scale integration of heterogeneous multi-sensory array on a flexible bulk silicon (100) substrate which can simultaneously sense pressure, temperature, strain and humidity under various physical deformation. We also showed an advance version of the device in a 3D printed packaged wearable gadget format which enables a pragmatic route to realize IoT devices focusing on integration of human-machine interface for wellness and healthcare technology.
Joanna M. Nassar, Galo A. Torres Sevilla, Seneca J. Velling, Marlon D. Cordero, Muhammad M. Hussain
Published in: Electron Devices Meeting (IEDM), 2016 IEEE International, 3-7 Dec. 2016
Remote controlled and self-operated self-destructive electronics for data security
In today's digital age, the increasing dependence on information also makes us vulnerable to potential invasion of privacy and cyber security. Consider a scenario in which a hard drive is stolen, lost, or misplaced, which contains secured and valuable information. In such a case, it is important to have the ability to remotely destroy the sensitive part of the device (e.g., memory or processor) if it is not possible to regain it. Many emerging materials and even some traditional materials like silicon, aluminum, zinc oxide, tungsten, and magnesium, which are often used for logic processor and memory, show promise to be gradually dissolved upon exposure of various liquid medium. However, often these wet processes are too slow, fully destructive, and require assistance from the liquid materials and their suitable availability at the time of need. This study shows Joule heating effect induced thermal expansion and stress gradient between thermally expandable advanced polymeric material and flexible bulk monocrystalline silicon (100) to destroy high-performance solid state electronics as needed and under 10 s. This study also shows different stimuli-assisted smartphone-operated remote destructions of such complementary metal oxide semiconductor electronics.
A. Gumus, A. Alam, A. M. Hussain, K. Mishra, I. Wicaksono, G. A. Torres Sevilla, S. F. Shaikh, M. Diaz, S. Velling, M. T. Ghoneim, S. M. Ahmed, M. M. Hussain, Adv. Mater. Technol. 2017, 2, 1600264.
CMOS technology enabled fully flexible and stretchable 360 imager for simultaneous imaging and dynamic focusing
Imaging is one of the important wonders of today’s world. While everyday millions of snaps are taken, new advances like panoramic imaging becomes increasingly popular. However, as of today an imaging system which can simultaneously capture images from all 360° viewpoints with a single sensor has not been achieved yet. Here, we show a physically flexible and stretchable version of arrayed silicon photodiodes – made from low-cost bulk monocrystalline silicon (100) that can capture simultaneous omnidirectional images. The present report, with multiple wavelength detection, fast photoresponsivity, wide viewing angle, selective aberration, and dynamic focusing enabled by 3D printed pneumatic actuators (note, today millions of image sensors can be integrated in mm2 area), for the first time, overcomes previous demonstrations of only hemispherical photodetection capability. Such imaging capability will make unmanned air vehicles or self-driven car safer, affordable augmented and virtual reality and more importantly in-vivo biomedical imaging will be more effective.
Pending US Patent (2017)