d. Soldering an SMD device to a standard PCB

QUESTION:

What technique should I use to solder an SMD device to a standard PCB?

ANSWER:

Most SMD chips have halved the pin spacing (approx. 0.4 mm) compared chips in DIP and SDIP cases. But some SMD devices that need only a few pins may use standard “DIP” spacing of around 0.8 mm. In theory, you can only solder every second pin of the SMD device to the standard experimental PCB. However, if you cut the PCB circles in half, you can solder all the pins with a steady hand and a soldering iron with 1 mm or smaller tip.

SMD devices with very low pin count can use “DIP” pin spacing of about 0.8 mm. This is also the case with FOX924B crystal oscillator. But it has no pins, just copper contacts at bottom. It is advisable to spread some zinc to form small zinc bubbles on each contact before trying to attach the chip to the PCB. Next, you have to spread some zinc to contacts on the PCB. Now, you have just to heat the contacts to attach the chip to the PCB. Do not forget that only proper hating ensures good electrical contacts.

20.000 MHz FOX924B oscillator with 4 contacts (one on each edge) soldered to a standard PCB