Electric field (E), magnetic field (H), Voltage (V), Current (I)
(Probe fields are using Fast Fourier Transform, FFT)
voltage source, current source, Resistor, Inductance , Capacitor, Wire, Load Wire (*.stl)
Load Wire (*.stl)
If the layer thickness (ex. FR-4 PCB, copper layer) is much less than resolution delta (dx)
(Structure thickness << dx)
Then use the Load Wire method, can tune the resolution order to get the better structure
(Even doesn't use probe field or lumped element, also need to press this button to create void grids )
Probe Electric field in Ex, Ey, Ez or |E|= sqrt(Ex^2+Ey^2+Ez^2), (without directional)
Probe Magnetic field in Hx, Hy, Hz or |H|= sqrt(Hx^2+Hy^2+Hz^2), (without directional)
Probe Voltage filed in x, y, z direction
Probe Current field in x, y, z direction
Voltage Source, (directional)
Current Source, (directional)
Resistor (Without directional)
inductance (Without directional)
Capacitor (Without directional)
Wire
(Load Wire *.stl)
Load Wire (*.stl)
If the layer thickness (ex. FR-4 PCB, copper layer) is much less than resolution delta (dx)
(Structure thickness << dx)
Then use the Load Wire method, can tune the resolution order to get the better structure