Microstrip Patch Antenna
中文/English
*Experiment data refer to paper :
Comparison & Reference:
D. M. Sheen , S. M. Ali , M. D. Abouzahara and J. A. Kong "Application of the three-dimensional Finite Difference Time Domain Method to the analysis of planner Microstrip Circuits", IEEE Trans. On Microwave Theory and Techniques, vol. 38, no. 7, pp.849 -857 1990
http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=55775&url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel1%2F22%2F2016%2F00055775.pdf%3Farnumber%3D55775
Add the boundary of the CAD files (FreeCAD)
Add the boundary of the CAD files (FreeCAD)
Reference : 3D-CAD Simulation & Examples
Reference : 3D-CAD Simulation & Examples
Define Parameters
Define Parameters
1. Selected the simulation dimension.
1. Selected the simulation dimension.
2. Define total x, y, z length that equal to CAD, and then set a appropriate resolution.
2. Define total x, y, z length that equal to CAD, and then set a appropriate resolution.
3. Import CAD files.
3. Import CAD files.
4. Define the material of each CAD.
4. Define the material of each CAD.
5. Press【建立網格 Cad to Grids (Create)】button to create simulation grids.
5. Press【建立網格 Cad to Grids (Create)】button to create simulation grids.
a.(Rogers 5880, Substrate DK = 2.2)
b. Due to the PCB metal layer thickness much less than resolution delta (metal layer thickness << dz),
the metal layer will be import by using "Load Wire (*.stl)" function in 【Probe & Lumped】
A. Define the boundary conditions
A. Define the boundary conditions
B. Press the【創建 (Create)】button => Create the total grid size (Include the boundary condition & add space)
B. Press the【創建 (Create)】button => Create the total grid size (Include the boundary condition & add space)
In this case, wave source use "Voltage Source",checked (None)
here using the PCB : Rogers 5880, DK=2.2,
A. define the Voltage Source
B. define the Probe V & I
C. Import the metal layer, due to the PCB metal layer thickness << delta (dz)
==> using the "Load Wire (*.stl)" function
Microstrip_Top_BC.stl
Microstrip_Bottom_BC.stl
Checked out the simulation geometries, and then press 【輸出 Output】button to output the geometries files
Checked out the simulation geometries, and then press 【輸出 Output】button to output the geometries files
Data_Materials.csv // (simulation index of structures)
Data_Materials.csv // (simulation index of structures)
Other simulation files refer to below figures:
Other simulation files refer to below figures:
*Experiment data refer to paper :
對照引用 Comparison & Reference:
D. M. Sheen , S. M. Ali , M. D. Abouzahara and J. A. Kong "Application of the three-dimensional Finite Difference Time Domain Method to the analysis of planner Microstrip Circuits", IEEE Trans. On Microwave Theory and Techniques, vol. 38, no. 7, pp.849 -857 1990
http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=55775&url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel1%2F22%2F2016%2F00055775.pdf%3Farnumber%3D55775