Microstrip Low Pass Filter
中文/English
*Experiment data refer to paper :
Comparison & Reference:
D. M. Sheen , S. M. Ali , M. D. Abouzahara and J. A. Kong "Application of the three-dimensional Finite Difference Time Domain Method to the analysis of planner Microstrip Circuits", IEEE Trans. On Microwave Theory and Techniques, vol. 38, no. 7, pp.849 -857 1990
http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=55775&url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel1%2F22%2F2016%2F00055775.pdf%3Farnumber%3D55775
*FEKO data refer to the FEKO website :
https://www.feko.info/applications/white-papers/low-pass-microstrip-filter
範例結果與CAD下載:
https://drive.google.com/open?id=18OEf1V9gk-jAW4rkCg-j3aWVQFkxCgeA
其中*.FCstd是FreeCAD的存檔
Add the boundary of the CAD files (FreeCAD)
Reference : 3D-CAD Simulation & Examples
Define Parameters
1. Selected the simulation dimension.
2. Define total x, y, z length that equal to CAD, and then set a appropriate resolution.
3. Import CAD files.
4. Define the material of each CAD.
5. Press【建立網格 Cad to Grids (Create)】button to create simulation grids.
a.(Substrate DK = 2.2)
b. Due to the PCB metal layer thickness much less than resolution delta (metal layer thickness << dz),
the metal layer will be import by using "Load Wire (*.stl)" function in 【Probe & Lumped】
A. Define the boundary conditions
B. Press the【創建 (Create)】button => Create the total grid size (Include the boundary condition & add space)
here using the PCB : Substrate DK=2.2,
A. define the Voltage Source
B. define the Probe V & I
C. Import the metal layer, due to the PCB metal layer thickness << delta (dz)
==> using the "Load Wire (*.stl)" function
Low_pass_sub_with_BC.stl
Low_pass_top_withBC.stl
Low_pass_bottom_withBC.stl
Port 1 :
Defined input side:
a. connect to Voltage Source (at least to has 1 signal source, Voltage or Current)
b. Probe Voltage
c. Probe Current
Port 2 ~ Port N :
Defined output side :
a. connect to Resistor
b. Probe Voltage
c. Probe Current
Checked out the simulation geometries, and then press 【輸出 Output】button to output the geometries files
Data_Materials.csv // (simulation index of structures)
Other simulation files refer to below figures:
*Experiment data refer to paper :
Comparison & Reference:
D. M. Sheen , S. M. Ali , M. D. Abouzahara and J. A. Kong "Application of the three-dimensional Finite Difference Time Domain Method to the analysis of planner Microstrip Circuits", IEEE Trans. On Microwave Theory and Techniques, vol. 38, no. 7, pp.849 -857 1990
http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=55775&url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel1%2F22%2F2016%2F00055775.pdf%3Farnumber%3D55775
*FEKO data refer to the FEKO website :
https://www.feko.info/applications/white-papers/low-pass-microstrip-filter
範例結果與CAD下載:
https://drive.google.com/open?id=18OEf1V9gk-jAW4rkCg-j3aWVQFkxCgeA