Chemical Vapor Deposition
Chemical vapor deposition (CVD) is a chemical process used to produce high-purity, high-performance solid materials. The process is often used in the semiconductor industry to produce thin films. In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber. CVD is practiced in a variety of formats. In IEN cleanroom, Plasmas Enhanced Chemical Vapor Deposition (PECVD) and Low Pressure Chemical Vapor Deposition (LPCVD) are available for materials listed below.
Plasma Enhanced Chemical Vapor Deposition (PECVD)
Low Pressure Chemical Vapor Deposition (LPCVD)