Standard Operation Procedure for Gasonics Asher
Purpose: to strip photoresist from the front and back of sample
Location: Pettit and Marcus Inorganic Cleanrooms
Setup Procedures:
1. Lift both wafer boats to reset the sensors.
2. Put the boats back onto the sensors.
a. Make sure the h-bar of the boat is placed over the sensor lever.
b. The left boat should stay up.
3. Load the wafers to be processed into the left boat.
a. Make sure all the wafer flats are facing the machine.
b. Make sure the wafers are pushed all the way to the back of the boat.
Number of substrates: up to 10 full wafers
Process Procedures:
1. Choose and run the desired recipe (30, 60 or 90 seconds).
2. Allow the wafers to cool for 2-3 minutes after the process is done.
3. Remove the wafer boat.
4. Remove your samples from the wafer boat.
5. Replace the wafer boat back on the sensor.
Time: approximately 15 minutes
Comments:
a. Only for use with full 4” wafers.
b. Up to 1um of photoresist can be removed during an ashing cycle.
c. Wafers will be heated (~250°C) during this process. Be careful when cleaning temperature sensitive samples.