Substrate Preparation
Substrate Cleaning: Cleanliness of substrates is essential for success processing in cleanroom. In most of cases, the quality of the processing products is critically dependent of conditions on the surface. Even a thin layer of grease can have such a gross effect on a molecular scale as to alter completely the characteristics of the layer. In furnace process, trace of residue left on sample surface will ended up diffusing into sample bulk and contamination of the furnace.
Substrate Cleaning: Cleanliness of substrates is essential for success processing in cleanroom. In most of cases, the quality of the processing products is critically dependent of conditions on the surface. Even a thin layer of grease can have such a gross effect on a molecular scale as to alter completely the characteristics of the layer. In furnace process, trace of residue left on sample surface will ended up diffusing into sample bulk and contamination of the furnace.
Substrate Lapping Polishing: Substrates thickness needs to be reduced to create stacking or high density packaging. Silicon wafers thinning can be down by "Back grounding", "CMP (Chemical-Mechanical Polishing)" or "Plasma Polishing"