Measurement of Thermal Expansion using Multiple Exposure Holographic Interferometry

Scott Holmstadt and Jeff Gunderson

University of Minnesota

Methods of Experimental Physics Spring 2012

Abstract

Using holographic interferometry, we measured the thermal expansion coefficients of copper, iron, and aluminum. The values obtained were (16.78±0.46)×10-6, (12.02±0.43)×10-6, and (27.05±0.41)×10-6 K-1 for copper, iron, and aluminum respectively.