Wafer-scale synthesis and phase engineering of transition metal dichalcogenides (MoS₂, WS₂).

- 1T/2H phase Engineering & Phase patterning

-TMDc-TMDc Heterostructure fabrication

-TMDc-Graphene Heterostructure fabrication

- AI semiconductor applications

-Defect Engineering

Precision plasma etching and atomic layer control for next-generation device fabrication.

- Atomic layer etching (ALE) process

- Damage minimization

- Wafer-Scale Layer-by-layer control

Real-time plasma monitoring and predictive modeling using OES, RGB, and machine learning algorithms.

- ANN / BNN / CycleGAN

- End point detection (EPD)

- Non-contact, real-time diagnostics

Development of plasma systems and AI-integrated platforms for semiconductor manufacturing.

- PECVD / RIE / ICP

- In-situ diagnostics integration

- Industrial scalability