CarrCondPolish

Parameters and polishing conditions can now be entered on the screen!!

The double-sided polishing platen correction simulation program can calculate and display changes in the removal amount and flatness of multiple petal carriers, which are placed symmetrically, sandwiched between upper and lower polishing platens, as well as the wear and flatness of the upper and lower platens. Compared to the previous program, it has been improved so that all parameters and initial shapes can be entered while viewing the screen, and the final calculation results can be obtained by clicking the Next Command button.

The structure of a double-sided polishing machine is complex. The rotation of the upper and lower platens, the rotation and revolution of the carriers, and the polishing pressure can all be freely changed. The removal amount of petal carriers and the wear amount of the upper and lower platens are calculated based on Preston's fundamental theoretical formulas for each coordinate point, assuming that it is proportional to the product of the relative velocity between the carriers and the upper and lower platens, pressure, and polishing time. The pressure is calculated based on the gap theory using the relative velocity along the trajectory traced by each point of the carrier, and the shapes of the carrier and the upper or lower platens. These are then integrated to calculate. The shape of the carrier is calculated at the radius and angular division points, and the shape of the platen is calculated by averaging for each platen radius.

 　(1) The carrier can be freely specified as petal-shaped, annular, disc-shaped, eccentric circle, etc.

　(2) The upper and lower platens are annular in shape, and the carriers are evenly distributed on the platens.

　(3) Pressure and the deformation of the polishing pad are proportional.

　(4) The calculation assumes that all carrier thicknesses are equal. The pressure distribution on the upper and lower surfaces of the carrier changes depending on the shape of the upper and lower platens, and if the carrier tilts as a result, an eccentric load occurs. This tilt is taken into account in the calculation.

　(5) The carrier is a rigid body that does not deform under pressure from the upper and lower platens.

 Its features are described below.

　(1) The inner and outer radii of the platen, the inner and outer radii of the carrier, the orbital radius of the carrier, and the eccentricity of the carrier's inner diameter are arbitrary.

　(2) The number of carriers placed on the platen is arbitrary.

　(3) The rotational speeds and pressures of the inner and outer rings that rotate the carrier, and the upper and lower platens, are arbitrary.

　(4) It is possible to process calculations with different input processing conditions all at once.

　(5) Instantly displays the carrier arrangement and gear shape within the surface plate.

　(6) The relative velocity distribution, pressure distribution, and gear rotation direction during polishing are displayed on the screen, and these can also be made by hardcopy, allowing you to see how the work and the upper and lower platens wear down.

　(7) Since the upper and lower shapes of the carrier can be input as a function of radius and angle, and the shapes of the upper and lower platens as a function of radius, it is possible to simulate the polishing process, including how the uneven shapes of the upper and lower platens created during pre-polishing affect the upper and lower shapes of carrier.

　(8) The carrier shape and platen shape can be plotted using grid lines in a 3D model.

　(9) You can choose to input either the rotational speed of the inner and outer rings, or the rotational speed of the carrier's rotation and revolution.

　(10) The carrier shape can be read from a black and white image (JPEG).

　(11) The system can calculate the results even if the carrier's inner diameter or petals protrude beyond the inner or outer circumference of the surface plate, and the amount of protrusion can also be set.

　(12) It is possible to process travel distance and shape calculations in a single operation.