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Post date: Jan 19, 2012 7:38:23 PM
Sun Microsystems wanted to provide their customers with a lower cost server blade for the Sun Blade 8000 product and removed 2 of 4 processors. I was tasked to design a component with the same airflow profile as the original heat-sink, but with a lower cost of fabrication.
Used a wind tunnel to optimize design by matching pressure v. airflow curve of injection molded and sheetmetal designs to the original heatsink.
During development a foam skirt was added to the bottom of the component to seal the processor socket from dust, allowing the customer to upgrade with a drop in processor.
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