The Quorum Q150T ES is a compact, high-performance thin film deposition system designed for both thermal evaporation and sputtering. This dual-functionality system enables precise and reproducible coating of samples with a variety of conductive and non-conductive materials. It is widely used in research laboratories for sample preparation, device fabrication, and surface modification.
The core function of this equipment is to deposit thin films of metals or other materials onto substrates under vacuum conditions using either thermal evaporation or magnetron sputtering techniques. In Thermal Evaporation mode the coat material is heated in a resistive source until it evaporates and condenses as a thin film on the substrate, while in Sputtering mode a plasma discharge bombards a solid sputtering target (diameter: 2.5 inches and high purity), ejecting atoms that deposit onto the substrate.
This system is essential for research involving nanofabrication, microelectronics, and materials science. It allows for precise control of film thickness and uniformity, which is critical in the fabrication of electronic contacts, sensor platforms, and sample coatings for electron microscopy.
The Quorum Q150T ES supports multiple deposition modes, each with tailored parameters for different research needs. This system has (for both modes) tooling factors and real-time thickness monitoring via a quartz crystal microbalance (QCM), ensuring reproducible results across samples.
Sputtering Mode:
The system features argon plasma sputtering with interchangeable metal targets (Ti, Au, Pt, Sn etc). Parameters such as plasma current, pressure, and deposition time can be finely controlled to achieve desired film thickness and adhesion. This mode is particularly useful for depositing base layers or adhesion-promoting materials in multilayer structures.
Thermal Evaporation Mode:
Utilizes resistive heating to evaporate metals such as gold (Au) for electrical contact fabrication.
In our research group, the Quorum Q150T ES plays a key role in the fabrication of electrical contacts via thermal evaporation of gold (Au). These contacts are integral to the development of nanoscale and microscale devices where low-resistance, high-purity metal interfaces are required. In addition, sputtering of metals such as tin (Sn) and titanium (Ti) is employed to create uniform thin films for surface modification, adhesion layers, or multi-metal stack configurations in material characterization studies and other purposes.
The versatility and reliability of the Q150T ES make it a central tool in ongoing experimental workflows, particularly in the preparation of samples for electrical, structural, and morphological analysis.