Dip coating is a cost-effective, scalable, and reproducible technique widely used in the fabrication of coatings for electronic, optical, and chemical applications. It allows for fine control over layer thickness and material composition, making it ideal for the development of multilayered structures, nanostructured films, and hybrid materials.
The Ossila Dip Coater is a precision-controlled system designed for the deposition of thin films via the dip coating technique. This method enables the fabrication of uniform coatings on solid substrates (e.g.: Si, Saphire, Quartz) by immersing them in a liquid solution and withdrawing them at a controlled speed. In our group, Dip Coating is employed to fabricate thin films from Langmuir-type precursor solutions with different organic precursors (nickel or magnesium stearates to name some). The system provides a simple yet highly effective approach for producing homogeneous and reproducible thin layers.
Dip coating relies on a balance between gravity, surface tension, and viscous drag. When a substrate is withdrawn from a solution at a controlled rate, a thin liquid film forms on its surface. Upon drying, this film solidifies into a uniform coating. Parameters such as withdrawal speed, solution concentration, and drying/annealing conditions determine the film’s thickness and uniformity.
The Ossila Dip Coater offers programmable and precise control of dipping parameters, enabling high reproducibility across sample batches. One of the most critical parameters in our applications is the immersion speed and concentration of the precursor, which directly influences the thickness, homogeneity, and adhesion of the resulting thin films. In our experiments, immersion speeds are carefully optimized depending on the solution viscosity and target film properties. The system allows adjustment of immersion and withdrawal speeds, typically in the range of 0.1 to 10 mm/s, and supports programmable immersion time, drying intervals, and number of cycles, making it suitable for multilayer film fabrication. It is compatible with various solution types, including for example Langmuir-type metal stearate solutions, and accommodates a range of substrate sizes. This level of control is essential for producing uniform, high-quality films which are used in the development of structured materials.
In our group, the Ossila Dip Coater is actively used to produce thin films from Langmuir-type solutions containing stearates as precursors. These films are currently being investigated as part of a broader effort to develop layered Transition Metal Oxides (TMOs) with potential applications in opto-electronic devices, semiconductors and functional coatings. The controlled deposition process ensures consistent film morphology and composition, which are key to achieving reliable device performance and reproducible experimental results.
Our latest research is currently under consideration for publication.