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SPAI Lab, Sejong University
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Captain (PI)
Members
Lab History
Research
SI/PI Simulation Methods
Hardware Security
2.5D/3D Packaging
EMC Design
Advanced Packaging for 2.5D/3D Custom Integration
Signal/Power Integrity Co-design
Hardware Security realization based on Packaging and EMC Technologies
AI-based Package-EDA
Publications
International Journals
International Conferences
Projects
Gallery
SPAI Lab, Sejong University
Home
Captain (PI)
Members
Lab History
Research
SI/PI Simulation Methods
Hardware Security
2.5D/3D Packaging
EMC Design
Advanced Packaging for 2.5D/3D Custom Integration
Signal/Power Integrity Co-design
Hardware Security realization based on Packaging and EMC Technologies
AI-based Package-EDA
Publications
International Journals
International Conferences
Projects
Gallery
More
Home
Captain (PI)
Members
Lab History
Research
SI/PI Simulation Methods
Hardware Security
2.5D/3D Packaging
EMC Design
Advanced Packaging for 2.5D/3D Custom Integration
Signal/Power Integrity Co-design
Hardware Security realization based on Packaging and EMC Technologies
AI-based Package-EDA
Publications
International Journals
International Conferences
Projects
Gallery
Hardware Security realization based on Packaging and EMC Technologies
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