(1) Signal/Power Integrity co-simulation Methods

(2) Hardware Security Realization based on Circuits, Electromagnetics, and Packaging

(3) Advanced Packaging for 2.5D/3D Integration 

(4) EMC Design:  A Key to Realize Low-noise and High-performance Electrical Devices

(1) Advanced Packaging for 2.5D/3D Custom Integration

(2) Signal/Power Integrity Co-design

(3) Hardware Security realization based on Packaging and EMC Technologies

(4) AI-based Package-EDA