International Journal List (Refereed)

* Indicates correspondence

1. 1. Joonsang Park, Seonguk Choi, Keeyoung Son, Junghyun Lee, Taein Shin, Keunwoo Kim, Boogyo Sim, Seongguk Kim, Jihun Kim, Jiwon Yoon,Youngwoo Kim*, Joungho Kim, "Pin-opt: Graph Representation Learning for Large-scale Pin Assignment Optimization of Microbumps considering Signal and Power Integrity", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 14, No. 4, pp. 681-692, April 2024.

1. 2. Keunwoo Kim, Hyunwook Park, Seongguk Kim, Youngwoo Kim*, Kyungjune Son, Daehwan Lho, Keeyoung Son, Taein Shin, Boogyo Sim, Joonsang Park, Shinyoung Park, and Joungho Kim, "Policy-based Reinforcement Learning (RL) for Through Silicon Via (TSV) Array Design in High Bandwidth Memory (HBM) Considering Signal Integrity (SI)", IEEE Transactions on Electromagnetic Compatibility, Vol. 66, No. 1, pp. 256-269, February 2024.

1. 3. Jihun Kim, Minsu Kim, Haeyeon Kim, Hyunwook Park, Seonguk Choi, Joonsang Park, Boogyo Sim, Keeyoung Son, Seongguk Kim, Jinwook Song, Youngwoo Kim*, and Joungho Kim, "Bayesian Exploration Imitation Learning-Based Contextual via Design Optimization Method of PAM-4-Based High-Speed Serial Link", IEEE Transactions on Electromagnetic Compatibility,  Vol. 65, No. 6, pp.1751-1762, December 2023.

1. 4. Junyong Park, Youngwoo Kim, and Donghyun Kim, "Accelerated Statistical Eye Diagram Estimation Method for Efficient Signal Integrity Analysis", IEEE Access, Vol. 11, pp.132699-132707, November 2023.

1. 5. Seonguk Choi, Keeyoung Son, Hyunwook Park, Seongguk Kim, Boogyo Sim, Jihun Kim, Joonsang Park, Minsu Kim, Haeyeon Kim, Jinwook Song, Youngwoo Kim*, and Joungho Kim, "Deep Reinforcement Learning-based Optimal and Fast Hybrid Equalizer Design Method for High-bandwidth Memory (HBM) Module", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 13, No. 11, pp.1804-1816, November 2023.

1. 6. Youngwoo Kim*, “Electrical Performance Analysis of High-speed Interconnection and Power Delivery Network (PDN) in Low-loss Glass Substrate-based Interposers", Micromachines, 14(10), 1880, pp.1-24, September 2023. 

1. 7. Youngwoo Kim*, “A Statistical Approach for Signal and Power Integrity Co-Design in High-speed Interconnects Considering Non-linear Power/Ground Noise and Bit-patterns", Micromachines, 14(9), 1654, pp.1-18, August 2023. 

1. 8. Daisuke Fujimoto, Takumi Okamoto, Yang Li, Youngwoo Kim, and Yuichi Hayashi, "Evaluation of Statistical Fault Analysis using Input Timing Violation of Sequential Circuit on Cryptographic Module Under IEMI", IEEE Transactions on Electromagnetic Compatibility,  Vol. 64, No. 1, pp.51-57, February 2023. 

1. 9. Taiki Kitazawa, Kimihiro Arai, Youngwoo Kim, Daisuke Fujimoto, and Yuichi Hayashi "A Novel Remote Visualization of Screen Images Against High-Resolution Display with Divided Screens Focusing on the Difference of Transfer Function of Multiple Emanations",  IEEE Transactions on Electromagnetic Compatibility,  Vol. 64, No. 6, pp.1941-1948, December 2022.

1. 10. Youngwoo Kim, Daisuke Fujimoto, and Yuichi Hayashi, "Simultaneous Security and EMC Evaluations Based on Measuring Electromagnetic Field Distributions on PCBs", IEEE Electromagnetic Compatibility Magazine, Vol. 11, No. 3, pp.84-92, December 2022.

1. 11. Youngwoo Kim*, “Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with Low-Loss Substrates", Micromachines, 13(9), 1433, pp.1-19, August 2022. 

1. 12. Taiki Kitazawa, Taiki Yamagiwa, Ren Kitahara, Youngwoo Kim, Jerdvisanop Chakarothai, Yuichi Hayashi, and Takashi Kasuga, "A Novel FDTD Approach Considering Frequency Dispersion of FR-4 Substrates for Signal Transmission Analyses at GHz Band", IEEE Transactions on Electromagnetic Compatibility, Vol. 64, No. 5, pp.1522-1532, October 2022.

1. 13. Daehwan Lho, Hyunwook Park, Shinyoung Park, Subin Kim, Hyungmin Kang, Boogyo Sim, Seongguk Kim, Junyong Park, Kyungjun Cho, Jinwook Song, Youngwoo Kim, and Joungho Kim, "Channel Characteristic-based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer", IEEE Transactions on Electromagnetic Compatibility, Vol. 64, No. 1, pp.196-208, February 2022.

1. 14. Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daewhan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Seongtaek Jeong, Youngwoo Kim, and Joungho Kim, “Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 11, No. 11, pp.1944-1970, November 2021.

1. 15. Shinpei Wada, Yuichi Hayashi, Daisuke Fujimoto, Naofumi Homma, and Youngwoo Kim*, “Measurement and Analysis of Electromagnetic Information Leakage from Printed Circuit Board Power Delivery Network of Cryptographic Devices”, IEEE Transactions on Electromagnetic Compatibility, Vol. 63, No. 5, pp.1322-1332, October 2021.

1. 16. Gapyeol Park, Youngwoo Kim, Kyungjun Cho, Junyong Park, Insu Hwang, Jihye Kim, Kyungjune Son, Hyunwook Park, Atom O. Watanabe, Pulugurtha Markondeya Raj, Rao R. Tummala, and Joungho Kim, “Measurement and Analysis of Through Glass Via (TGV) Noise Coupling and Shielding Structures in a Glass Interposer”, IEEE Transactions on Electromagnetic Compatibility, Vol. 63, No. 5, pp.1562-1573, October 2021.

1. 17.  Boogyo Sim, Seungtaek Jeong, Youngwoo Kim, Shinyoung Park, Seongsoo Lee, Seokwoo Hong, Jinwook Song, Hongseok Kim, Hyungmin Kang, Hyunwook Park, Daewhan Lho, and Joungho Kim, “A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System”, IEEE Transactions on Electromagnetic Compatibility, Vol. 63, No.3, pp.935-946, June 2021.

1. 18.  Youngwoo Kim*, Junyong Park, Joungho Kim, and Yuichi Hayashi, “Statistical Eye-diagram Estimation Method Considering Power/Ground Noise Induced by Simultaneous Switching Output (SSO) Buffers”, IEEE Transactions on Electromagnetic Compatibility, Vol. 62, No.2, pp.2547-2557, December 2020.

1. 19. Youngwoo Kim*, Gapyeol Park, Kyungjun Cho, Pulugurtha Markondeya Raj, Rao R. Tummala, and Joungho Kim, “Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure”, IEEE Transactions on Microwave Theory and Techniques, Vol. 68, No.12, pp.5055-5064, December 2020.

1. 20.  Kyungjune Son, Kyungjun Cho, Subin Kim, Shinyoung Park, Daniel H. Jung, Junyong Park, Gapyeol Park, Seongguk Kim, Taein Shin, Youngwoo Kim, and Joungho Kim, “Signal Integrity Design and Analysis of 3D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 10, No.5, pp.858-869, May 2020.

1. 21. Youngwoo Kim*, Daisuke Fujimoto, Shugo Kaji, Shinpei Wada, Hyunwook Park, Daehwan Lho, Joungho Kim, and Yu-ichi Hayashi, “Segmentation Method based Modeling and Analysis of a Glass Package Power Distribution Network (PDN)”, IEICE Nonlinear Theory and Its Applications (NOLTA), Vol.E11, No.2, 170-188, April 2020.

1. 22. Hyunwook Park, Junyong Park, Subin Kim, Kyungjun Cho, Daehwan Lho, Seungtaek Jung, Shinyoung Park, Gapyeol Park, Boogyo Sim, Seongguk Kim, Youngwoo Kim, and Joungho Kim, “Deep Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for Silicon Interposer-based 2.5-D/3-D ICs”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.10, No.3, pp.467-478, March 2020.

1. 23. Seokwoo Hong, Youngwoo Kim, Seungtaek Jeong, Boogyo Shim, Hongseok Kim, Seungyoung Ahn, and Joungho Kim, “A Frequency Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems using Resonant Frequency Control of a Shielding Coil in Smartphone Application”, IEEE Transactions on Electromagnetic Compatibility, Vol.61, No.6, pp.2031-2039, December 2019.

1. 24. Junyong Park, Shinyoung Park, Youngwoo Kim, Gapyeol Park, Hyunwook Park, Daehwan Lho, Kyungjun Cho, Seongsoo Lee, Dong-Hyun Kim, and Joungho Kim, “Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling”, IEEE Transactions on Electromagnetic Compatibility, Vol.61, No.6, pp.1867-1875, December 2019.

1. 25. Kyungjun Cho, Youngwoo Kim, Subin Kim, Hyunwook Park, Junyong Park, Seongsoo Lee, Daeyong Shim, Sangmook Oh, and Joungho Kim, "Fast and Accurate Power Distribution Network (PDN) Modeling of A Silicon Interposer for 2.5-D/3-D ICs with Multi-array TSVs", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.9, No.9, pp.1835-1846, September 2019.

1. 26. Junyong Park, Daniel H. Jung, Byunggon Kim, Sumin Choi, Youngwoo Kim, Shinyoung Park, Gapyeol Park, Kyungjun Cho, Seongsoo Lee, and Joungho Kim, “A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation with N-Level (PAM-N) on Stacked Through-Silicon Vias”, IEEE Transactions on Electromagnetic Compatibility, Vol. 61, No. 4, pp. 1198-1206, August 2019.

1. 27. Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song, and Joungho Kim, “Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, No. 2, pp. 317-328, February 2019.

1. 28. Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Jinwook Song, Junyong Park, Seongsoo Lee, Subin Kim, Gapyeol Park, Kyungjune Son, and Joungho Kim, “Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer with Through-Silicon Via”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, No. 1, pp. 107-121, January 2019.

1. 29. Junyong Park, Sumin Choi, Jonghoon J. Kim, Youngwoo Kim, Manho Lee, Heegon Kim, Bumhee Bae, Huijin Song, Kyungjun Cho, Seongsoo Lee, Hyunsuk Lee, and Joungho Kim, "A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels", IEEE Transactions on Electromagnetic Compatibility, Vol. 60, No. 5, pp. 1510-1519, October 2018.

1. 30. Chiuk Song, Hongseok Kim, Youngwoo Kim, Donghyun Kim, Seungtaek Jeong, Yeonje Cho, Seongsoo Lee, Seungyoung Ahn, and Joungho Kim, "EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field", IEEE Transactions on Industrial Electronics, Vol. 65, No. 09, pp. 6639-6849, September 2018.

1. 31. Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Heegon Kim, Sumin Choi, Subin Kim, Junyong Park, Seongsoo Lee, and Joungho Kim, "Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High Bandwidth Memory (HBM) Interface", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.8, No. 9, pp. 1658-1671, September 2018.

1. 32. Min Suk Kim, Markondeya Raj Pulugurtha, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim and Rao Tummala, “Miniaturized and high-performance RF packages with ultra-thin glass substrates”, Elsevier Microelectronics Journal, Volume 77, July 2018, pages 66-72.

1. 33. Shinyoung Park, Jinwook Song, Subin Kim, Youngwoo Kim, Manho Lee, and Joungho Kim, "Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 08, No. 04, pp. 519-530, April 2018.

1. 34. Yougnwoo Kim*, Jonghyun Cho, Kyungjun Cho, Junyong Park, Subin Kim, Dong-Hyun Kim, Gapyeol Park, Srikrishna Sitaraman, Pulugurtha Markondeya Raj, Rao R. Tummala, and Joungho Kim, "Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, No. 9, pp. 1493-1505, September 2017.

1. 35. Srikrishna Sitaraman, Vijay Sukumaran, Markondeya Raj Pulugurtha, Zihan Wu, Yuya Suzuki, Youngwoo Kim, Venky Sundaram, Joungho Kim, and Rao Tummala, “Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, No. 9, pp. 1410-1418, September 2017.

1. 36. Jonghoon J. Kim, Heegon Kim, Daniel H. Jung, Sumin Choi, Jaemin Lim, Youngwoo Kim, Junyong Park, Hyesoo Kim, Dongho Ha, Michael Bae, and Joungho Kim, "Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test with Silicone Rubber-based Sheet Contact", IEEE Transactions on Electromagnetic Compatibility, Vol. 59, No. 4, pp. 1239 - 1251, August 2017.

1. 37. Dong-Hyun Kim, Youngwoo Kim, Jonghyun Cho, Bumhee Bae, Junyong Park, Hyunsuk Lee, Jaemin Lim, Jonghoon J. Kim, Stefano Piersanti, Francesco de Paulis, Antonio Orlandi, and Joungho Kim, "Through-Silicon Via Capacitance–Voltage Hysteresis Modeling for 2.5-D and 3-D IC". IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, No. 6, pp. 925-935, June 2017.

1. 38. Youngwoo Kim*, Jonghyun Cho, Jonghoon J. Kim, Kyungjun Cho, Subin Kim, Srikrishna Sitaraman, Venky Sundaram, Pulugurtha Markondeya Raj, Rao R. Tummala, and Joungho Kim, "Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling", IEEE Transaction on Electromagnetic Compatibility, Vol. 59, No. 3, pp. 940-951, June 2017.

1. 39. Daniel H. Jung, Youngwoo Kim, Jonghoon J. Kim, Heegon Kim, Sumin Choi, Yoon-Ho Song, Hyun-Cheol Bae, Kwang-Seong Choi, Stefano Piersanti, Francesco de Paulis, Antonio Orlandi, and Joungho Kim, "Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, No. 1, pp. 138 - 152, January 2017.

1. 40. Youngwoo Kim*, Jonghyun Cho, Jonghoon J. Kim, Kiyeong Kim, Kyungjun Cho, Subin Kim, Srikrishna Sitaraman, Venky Sundaram, Pulugurtha Markondeya Raj, Rao Tummala, and Joungho Kim, "Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel", IEEE Transactions on Electromagnetic Compatibility, Vol. 58, No. 6, pp. 1747-1759, December 2016.