Education

• Ph.D., Korea Advanced Institute of Science and Technology (KAIST), Electrical Engineering, Tera-lab, 2015.03 ~ 2018.08 (EE Top Achievement 2017)

• M.S., Korea Advanced Institute of Science and Technology (KAIST), Electrical Engineering, Tera-lab, 2013.03 ~ 2015.02

• B.S., Korea University, Electrical Engineering, 2009.03 ~ 2013.02 (with Honor)

Professional Experience

• Associate Professor, Department of Semiconductor System Engineering, Sejong University, Korea, 2024.09 ~ Present

• Vice Provost, Sejong University, Korea, 2025.03 ~ Present

• Assistant Professor, Department of Semiconductor System Engineering, Sejong University, Korea, 2023.03 ~ 2024.08

• Assistant Professor, Division of Information Science, Nara Institute of Science and Technology (NAIST), Japan, 2019.07 ~ 2023.02

• Post-doctoral Researcher, Institute of Information and Electronics, KAIST, 2018.09 ~ 2019.06

• Graduate Research Assistant, School of Electrical Engineering, KAIST, 2013.03 ~ 2018.08

• Technical Consultant, Invecas Inc. (USA & India), Specialized in signal/power integrity for AI-core, SoC, SerDes, LPDDR, and HDMI, 2018.01 ~ 2019.06

• Technical Consultant, Lattice Semiconductor (USA), Specialized in signal/power integrity for HDMI, 2017.01 ~ 2017.09

• Standard Activity, HDMI Forum, Specialized in connectors and cables, 2017.01 ~ 2019.06

+ My previous lab at NAIST (focusing on hardware security). I am closely collaborating with prof. Hayashi & Fujimoto, leaders of the lab. 

Professional Activities & Services

• Associate Editor, IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT), 2020.11 ~ Present

• Best Paper Awards Review Committee, IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2020.

• Technical Program Committee Member, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2020.

• Technical Program Committee Member & Special Session Organizer & Reviewer, 2022 Asia Pacific International Symposium on Electromagnetic Compatibility (APEMC) 

• Technical Program Committee Member & Reviewer, 7th IEEE Global EMC Conference (GEMCon) 2023.

• Technical Program Committee Member & Reviewer, 2024 Asia-Pacific Microwave Conference

• Technical Program Committee Member & Reviewer, Asian Hardware Oriented Security and Trust (AsianHOST) 2024.

• Technical Program Committee Member & Reviewer, 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity

• Journal Reviewer:

IEEE Transactions on Electromagnetic Compatibility (TEMC)

IEEE Transactions on Components, Packaging, and  Manufacturing Technology (TCPMT)

IEEE Transactions on Microwave Theory and Techniques (TMTT)

IEEE Microwave and Wireless Components Letters (MWCL)

IEEE Transactions on Computer-aided Design on Integrated Circuits and Systems (TCAD)

IEEE Transactions on Circuits and Systems I (TCAS I)

IEEE Transactions on Power Electronics (TPE)

IEEE Access

IEEE Transactions on Signal Integrity and Power Integrity (TSIPI)

Journal of Electromagnetic Waves and Applications

Wiley Microwave and Optical Technology Letters

MDPI Journals: Applied Science/ Energies/ Electronics/ Symmetries

Hindawi Journal