Welcome to the System Packaging and Interconnection (SPAI) Laboratory

Welcome! I am an Associate Professor at Sejong University, Seoul, Korea. I define my research as "PI4X: Packaging and Interconnection for Everything".

I am especially interested in Signal/Power Integrity, Advanced Packages & Interconnects, 2.5D/3D Integration, EMI/EMC, High-speed systems, and Hardware Security.

I am always eager to hear from you, so please contact me!