- List of Lab Main Tools -

Custom UHV Capable Plasma Enhanced ALD

  • UHV ALD equipped with load lock
  • Base pressure: ~10-9 Torr
  • Substrate heater: 400C max
  • Working pressure: 1 to 10 Torr (lower or higher with modifications)
  • 4 precursor manifold
  • “Subchamber” design to minimize process volume
  • Residual gas analyzer to check vacuum health
  • Currently equipped with TMEIC nitrogen radical generator
  • Future plans to install Meaglow hollow cathode plasma

Ultratech/Cambridge Savannah S100

  • 4 inch wafer capability
  • Laminar flow design
  • Substrate heater: 325C max
  • Base and working pressure: 200 mTorr
  • 4 precursor manifold with selectable ozone/water line
  • Flexible control software enabling customizable process flow

NCD G100 RTCVD

  • Rapid thermal process CVD/ALD
  • 6 inch wafer capability
  • Lamp heater capable of process up to 1050C
  • Multi-temperature recipes possible with ramp up/down rate control
  • High vacuum base pressure: less than 10-7 Torr
  • Working pressure: ~100 mTorr
  • 2 process gas lines (configurable for NH3, H2, O2, O3, CH4, etc)
  • 1 precursor line

NCD D100 MALD

  • Molecular/atomic layer deposition
  • 6 inch wafer capability
  • Can deposit organic molecules in addition to traditional ALD films
    • Laminate structures are readily realized
    • TEM shows example laminate structures
  • Substrate heater: 200C max
  • Base pressure: 10 mTorr
  • Working pressure: ~100 mTorr
  • 4 precursor lines
  • UV lamp for UV assisted growth

Capacitively Coupled Plasma ALD

  • Capacitively coupled plasma ALD enables direct plasma interaction with sample
  • 4 inch wafer capability
  • Sample heater: 300C max
  • Base pressure: with turbo, ~10-6 Torr
  • Working pressure: ~100 mTorr
  • 2 precursor lines and 2 process gases

Combined Raman/AFM

  • Renishaw Raman system coupled to an NTMDT atomic force microscope
    • Combined AFM/Raman allows simultaneous Raman scanning of AFM area
    • Tip enhanced Raman possible
    • Can run as stand alone Raman or AFM
  • Raman has mapping capabilities with ~500 nm spatial resolution
    • Selectable 532/441 nm laser wavelength
  • Temperature cell allows in-situ heating cooling of sample during Raman (77K-500C)

Cluster Tool for J. Kim’s Lab

  • Future cluster tool will incorporate the UHV PEALD, an electrical characterization chamber, a thermal Picosun ALD and a surface analysis module
  • All chambers have been ordered
  • Initial assembly to be finished by Feb. 2015

Ozone Generator

  • TMEIC ozone generator
  • Can supply nitrogen free ozone from UHP oxygen
    • Unique capability in industry
  • Concentration as high as 400 g/m3 possible

Environmental Consciousness

  • Hazardous gases from ALD process are neutralized by an Ecosys CDO “burnbox”
  • Non-combustible gases are removed by building mounted exhaust scrubbers

The Cleanroom Tools (Common Users Facilities)

The University of Texas at Dallas (UTD) Cleanroom Research Laboratory is a facility with filtered, vertical laminar flow air, equipped with versatile semiconductor process research equipment assembled for the purpose of supporting university research in the fields of microelectronics, electronic materials, nanotechnology, MEMS, lithography, optics, and other areas requiring a particle-free environment.

The Cleanroom Research Laboratory is a cross-disciplinary center. It is physically located at the “Natural Science & Engineering Research Laboratories” building, or NSERL. A university-wide advisory committee, composed of members from diverse fields, provides the associate director of the facility with information on the needs and desires associated with faculty research.The Cleanroom Research Laboratory at UT Dallas offers an excellent location for various technical organizations and companies to carryout research activities. The Laboratory includes facilities for device fabrication and characterization with a range of equipment, such as plasma etch, PECVD, LPCVD, Metallization (sputter, e-gun, thermal evap), wet chemical stations, thermal (oxidation/diffusion, RTP) Lithography, and surface analysis tools.

Characterization & Metrology

  • Leica INM 200 Optical Microscope
  • Leica INM 100 Optical Microscope
  • Zeiss Supra 40 Scanning Electron Microscope
  • Veeco Dimension 5000 SPM
  • Sentech Ellipsometer
  • Jandel Multiposition Wafer Probe
  • Alessi 4-Point Probe
  • Thermo Electron FTIR Spectrometer w/Ge ATR
  • TOHO FLX2320 Thin Film Stress Measurement
  • Veeco Dektak VIII Prolifometer
  • Nanometrics Nanospec Film Thickness
  • Rame’-Hart Goniometer (page under construction)

Deposition

  • Tystar LPCVD Furnace
  • Plasma-Therm 790 PECVD
  • Cambridge NanoTech Savannah 100 Atomic Layer
  • SCS Parylene Deposition

Plasma Etch

  • Plasma-Therm ICP-Metal Etch
  • Plasma-Therm Dielectric Etch & DSE
  • Plasma-Therm III-V’s
  • Technics RIE
  • March Asher PX250

Lithography

  • Heidelberg DWL66 Laser Writer
  • Quintel Q4000-6 Contact Printer
  • Karl Suss MA6B Contact Printer
  • Obducat Nano-Imprinter NIL-2.5″ Imprint
  • Ultratech Mask Cleaner
  • CEE Spin Coater
  • Headway Spinner
  • CPK Chrome Etch & Base Develop
  • CPK Solvent Develop
  • Blue M Ovens
  • Cole Parmer Ovens
  • HMDS
  • Cole Parmer Digital Hot Plates
  • TPS Digital Hot Plates
  • Raith 150-TWO E-Beam Litho

Packaging

  • K&S Ball Wire Bonder

Thermal Processing

  • JetFirst RTP
  • MPTC600 RTP
  • MiniBrute Furnace
  • Tystar Diffusion/Oxidation Furnace

Thin Film Deposition

  • Cryo-evaporator e-gun Deposition
  • Temescal e-gun Deposition
  • CHA Mark 50 e-gun Evaporator
  • Hummer VI Sputter (for SEM samples)
  • AJA 1500 Sputter
  • AJA Orion Sputter

Surface Chemistry (Wet Processing)

  • Avenger Basic Dual Chamber Spin Rinse Dryer
  • Tousimis Supercritical Drier (MEM structure release)
  • Samco UV Ozone Stripper/Cleaner
  • Acid Hood
  • Base Hood
  • RCA Hood
  • General Solvent Hood
  • Solvent Hood