ME677

ME677 [Thermal Management of Electronics]  -  2nd Semester 2023-24


Course Outline [PDF File]


Course content: Introduction to microelectronic devices, Historical development, Moore’s law, Heat flux dissipation in electronic devices, Temperature dependent failures, Reliability aspects. Review of principles of conduction, convection and radiation, Thermal resistance network, Governing fluid dynamic and energy equations, physical significance and length scales, Low Reynolds number flows, Diffusion limit, Principles of micromixing, Microchannel heat sinks, fans, air vs water cooling, Flow distribution, Jet impingement cooling, Micro pin-fin heat sinks, Confined vortex shedding, Phase change cooling: Heat pipes, Phase change materials, Flow boiling, Thin Film evaporation, Hotspots in microelectronics, Active approaches for targeted thermal management, Passive targeted cooling of hotspots in microelectronics, Thermal management of 3D integrated chipstacks, Energy consumption in datacenters, performance metrics, Reuse of waste heat, Thermal management of batteries and electrochemical systems. 


Useful books:


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Open Source Softwares:


ANSYS (Engineering Simulation Software):