(CPC) H01B1/22 - the conductive material comprising metals or alloys [3] –
H01L31
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F-Term 3C063 - 研磨相關器具
F-Term 4G072
F-Term 4G077 - 長晶 及 長晶後處理
F-Term 5F151
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USC 136/243以下
USC 438 :SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS