Mini Sputtering

Available Processes:

• Sputter deposition of Au/Pd thin films onto SEM samples to prevent charging effects

Cleaning procedures:

• Wipe the inside of the chamber with a lint-free tissue moistened with 50:50 mixture of acetone and isopropanol; do use pure isopropanol to clean o-rings

Key Features and Accessories:

• Magnetron sputter head
• MTM-10 thickness monitor based on quartz crystal microbalance

Key Specifications:

• Working pressure: 0.04 mbar
• Plasma discharge current: 40 mA
• Substrate size: approx. 2x3 cm^2

Allowed Materials:

• Au, Au/Pd