Available Processes:
- Evaporation of metals such as Al, Ag, Au, AuPd, Ti, Cu, Ge.
Key Features and Accessories:
- Sample tilting with half a degree resolution
- Oxygen line for in-situ oxidation (static pressure, Load-Lock)
- Oxygen line for in-situ evaporation of Ti oxides (static pressure, dep. chamber)
Key Specifications:
- Working pressure: 10-6 to 10-9 mbar
- Substrate temperature: Room temperature
- Deposition rate: 0.1 - 2 nm/s
- Pumping time needed: ~60 min
Allowed Materials:
- Al, Ag, Au, AuPd, Ti, Cu, Ge.
Forbidden Materials: