Conducted research on bonding low-dielectric constant-based polymers to replace SiO2-SiO2 bonding, which physically connects chips. Hybrid bonding is performed using thermal reactions of epoxy and amine functional groups in polymer membranes such as siloxane-based pV3D3. Performed basic research on patterning Cu and iCVD polymer membranes to perform heterojunction bonding. Perform heterojunction integration research and plasma and barrier-free polymer formation technology capable of heterojunction. (Co-work with SNUST)