Sponsor: Device Solutions Inc.
Mentor(s):
Spencer Mougey smougey@device-solutions.com
Chris Lamb chris.lamb@device-solutions.com
Background of Company:
Device Solutions is a nearly 18 year old engineering services company focused on embedded software and hardware development for the 'Internet of Things' and similar fields. We are a small team of approximately 20 people and we leverage a reusable hardware/software platform in many customer projects and our Cellio product.
Project Background and Need:
Device Solutions utilizes a core software suite to decrease development time, increase reliability and provide more affordable solutions to our customers. Currently, this is based on a custom LoRa protocol and payload definition. We would like to incorporate LoRaWAN into the software platform, as well as standard payload protocols to enable us to quickly develop LoRaWAN based devices which can be utilized on commercial networks and easily integrated with common cloud platforms such as those from Tago, Kopis and many others.
Problem Description/requirements (List of high-level functionality you expect to see in the end product):
At the end of this project we expect the following functionality to be operational on a Device Solutions Cellio Transceiver:
Join a commercial LoRaWAN network such as those provided by Senet or Everynet
Send sensor data receive/measured from the I/O pins to a cloud platform such as Tago (Device Solutions will select), leveraging the existing code to make the measurements and manage the timing. Where possible, the variable definitions and measurements should conform to our "CUP" protocol.
Define a configuration message which can be sent by the cloud platform to the device to configure measurement and reporting frequency.
Support the existing low power sleep mode (~5uA)
Support any necessary additions to the test and debug functionality.
Required Skills / Desired Competencies (in order of importance):
Embedded programming and hardware
Wireless communications programming
Networking
Programming experience with hardware modules interface
PCB design and layout
How often and how would you be available to meet/chat with the team (Zoom, Hangout, Skype, Phone)?
1/week, in person or Teams as necessary
Will the students be required to sign any of the following before they start with the project? NDA / CDA / IP assignment / IP protection form
NDA will need to be signed.