Overview of Status of Analysis, Design, Fabrication, Tests, etc.
Analysis Status:
Energy Required to Cool Materials to 4K:
Method of analysis discovered and formulated.
Research of Cryogenic Data for various materials is underway.
Time to Cool Materials to 4K:
Method of analysis discovered and formulated.
Consultation with Sponsor has led to the conclusion that this area of analysis can be neglected (except in extreme cases).
Thermal Deformation due to Temperature Change:
Data collected and analyzed for various materials led to the conclusion that this property is negligible.
This conclusion does not hold for materials bonded/welded together.
Electromagnetic Permeability of Materials:
Research and Data Collection ongoing.
RAM (Radar Absorbing Material) being investigated.
Design:
Two Designs are under consideration currently.
Both have been reviewed and accepted by our sponsor.
Selection of Final Design is underway.
Fabrication:
Not Yet Started.
Tests:
Not Yet Started.
Accomplishments from Previous Week
Team went to Oasis and took a tour of their facility and observed their manufacturing processes. Discovered how the design of our component should be approached and what deliverables a company such as Oasis would expect from us in order to produce our product.
After research and consulting with sponsor, aluminum nitride has been determined to be our material of choice.
Sponsor has determined that both of our designs are sufficient. Visit with Oasis determined that our more ambitious design is very reasonable at their facility
Goals for Next Week (list names after each item). Use specific and measurable objectives.
Design of Top fastening plate to secure chip down to bracket ( Daniel & Richard )
Layered design of all circuitry to be placed in AlN Substrate according to specified design guidelines ( Aimen & Richard )
Investigation of Translucency of Aluminum Nitride & effect of electromagnetic reflection of circuitry within substrate ( Patrick )
Investigation of approved vendors from SPAWAR ( Group )
Sponsor Comments from Last Meeting and Actions Taken to Address these Comments (indicate date of comments and if via email or in person)
Sponsor had concerns about our "all-pad" connection design, depth of chip cutout must be minimized and not interfere with signal, and the area of the entire surface the chip resides on must also be minimized.
Instructor Comments from Last Meeting and Actions Taken to Address these Comments (indicate date of comments and if via email or in person)
Instructor suggested we look into different manufactures of Metallized Ceramic Substrates -- March 29th during spring break, the team went to Oasis and took a tour of their facility
Comments from Other Students in the Class (indicate date of comments and if via email or in person)
Risks and Areas of Concern
Thermal Conductivity of plate to bracket
Shielding of wires within bracket design -- it is unknown if shielding would be reflective or absorbent of incoming EM waves
Balance of material size/mass
Small Stand is easier to manufacture and construct.
Large Stand required more energy to cool and created more electromagnetic interference.
Resources or Information Required but not Available
Schedule
Describe upcoming milestone
Update Gantt chart.
Budget (list amount spent and amount remaining)
Amount Spent:
$0.00
Amount Remaining:
$2,500.00
Progress on Report and Webpage
Report: Research Phase
Webpage: Up to Date (as of 4/3/2012)